EEWORLDEEWORLDEEWORLD

Part Number

Search

ZX74HCTLS123J+

Description
Monostable Multivibrator, CMOS, CDIP16
Categorylogic    logic   
File Size70KB,1 Pages
ManufacturerRadiation Semiconductor Corp
Download Datasheet Parametric Compare View All

ZX74HCTLS123J+ Overview

Monostable Multivibrator, CMOS, CDIP16

ZX74HCTLS123J+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRadiation Semiconductor Corp
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T16
JESD-609 codee0
Logic integrated circuit typeMONOSTABLE MULTIVIBRATOR
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

ZX74HCTLS123J+ Related Products

ZX74HCTLS123J+ ZX54HCTLS123J+ ZX54HCTLS123J ZX74HCTLS123J ZX74HCTLS123N
Description Monostable Multivibrator, CMOS, CDIP16 Monostable Multivibrator, CMOS, CDIP16 Monostable Multivibrator, CMOS, CDIP16 Monostable Multivibrator, CMOS, CDIP16 Monostable Multivibrator, CMOS, PDIP16
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Radiation Semiconductor Corp Radiation Semiconductor Corp Radiation Semiconductor Corp Radiation Semiconductor Corp Radiation Semiconductor Corp
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T16 R-XDIP-T16 R-XDIP-T16 R-XDIP-T16 R-PDIP-T16
JESD-609 code e0 e0 e0 e0 e0
Logic integrated circuit type MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR
Number of terminals 16 16 16 16 16
Maximum operating temperature 85 °C 125 °C 125 °C 85 °C 85 °C
Minimum operating temperature -40 °C -55 °C -55 °C -40 °C -40 °C
Package body material CERAMIC CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY MILITARY INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Certification status - - Not Qualified Not Qualified Not Qualified
The PIC microcontroller is a small computing
PIC microcontrollers have computing functions and memory like a CPU and are controlled by software. However, the processing power - memory capacity is very limited, depending on the type of PIC. But t...
hodenshi Microchip MCU
Looking for embedded development engineers
Welcome to recommend and contact us on the site!...
sanqi Embedded System
CCS v6.0 activation problem
I recently downloaded and installed Code Composer Studio (CCS) v6.0.0.00190. The overall interface is more user-friendly, and some small functions make it more convenient to start the program than 3.3...
Abey Microcontroller MCU
AT32WB415 Review] 6. Using batteries to power the RTC
Last time I talked about RTC, today I had some time, so I looked at the schematic diagram and data sheet:It can be seen that pin 43 is the VBAT pin. I went to the development board to find it, and whe...
ddllxxrr RF/Wirelessly
What if I don't have enough E coins to sell things?
Hello everyone, I want to buy something on JD.com, but I found that I don’t have enough E coins. Then I have a few classmates who have dozens of E coins. I want to ask the administrator if he can help...
zh471021698 Talking
The difference between SOP packaged voice chip and DIP packaged voice chip!
SOP packaging is a form of component packaging. Common packaging materials include plastic, ceramic, glass, metal, etc. Plastic packaging is now basically used. It has a wide range of applications and...
次狐狸 FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1328  1546  787  132  648  27  32  16  3  14 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号