EEWORLDEEWORLDEEWORLD

Part Number

Search

BSS126E6327

Description
Small Signal Field-Effect Transistor, 0.021A I(D), 600V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3
CategoryDiscrete semiconductor    The transistor   
File Size253KB,9 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

BSS126E6327 Overview

Small Signal Field-Effect Transistor, 0.021A I(D), 600V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3

BSS126E6327 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerInfineon
package instructionSMALL OUTLINE, R-PDSO-G3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage600 V
Maximum drain current (Abs) (ID)0.021 A
Maximum drain current (ID)0.021 A
Maximum drain-source on-resistance500 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
Maximum feedback capacitance (Crss)1.5 pF
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Number of components1
Number of terminals3
Operating modeDEPLETION MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)0.5 W
Certification statusNot Qualified
surface mountYES
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Transistor component materialsSILICON
BSS126
SIPMOS
®
Small-Signal-Transistor
Features
• N-channel
• Depletion mode
• dv /dt rated
• Available with V
GS(th)
indicator on reel
• Pb-free lead plating; RoHS compliant
Product Summary
V
DS
R
DS(on),max
I
DSS,min
600
700
V
0.007 A
PG-SOT-23
Type
BSS126
BSS126
Package
PG-SOT-23
PG-SOT-23
Pb-free
Yes
Yes
Tape and Reel Information
L6327: 3000 pcs/reel
L6906: 3000 pcs/reel sorted in
V
GS(th)
bands
1)
Marking
SHs
SHs
Maximum ratings,
at
T
j
=25 °C, unless otherwise specified
Parameter
Continuous drain current
Symbol Conditions
I
D
T
A
=25 °C
T
A
=70 °C
Pulsed drain current
I
D,pulse
T
A
=25 °C
I
D
=0.016 A,
V
DS
=20 V,
di /dt =200 A/µs,
T
j,max
=150 °C
Value
0.021
0.017
0.085
Unit
A
Reverse diode dv /dt
dv /dt
6
kV/µs
Gate source voltage
ESD
class
(JESD22-A114-HBM)
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
1)
V
GS
±20
0 (<250V)
V
P
tot
T
j
,
T
stg
T
A
=25 °C
0.50
-55 ... 150
55/150/56
W
°C
see table on next page and diagram 11
Rev. 1.6
page 1
2009-08-18

BSS126E6327 Related Products

BSS126E6327 BSS126L6327 BSS126L6906 BSS126H6327 BSS126E6906
Description Small Signal Field-Effect Transistor, 0.021A I(D), 600V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3 Small Signal Field-Effect Transistor, 0.021A I(D), 600V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3 Small Signal Field-Effect Transistor, 0.021A I(D), 600V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3 Small Signal Field-Effect Transistor, 0.021A I(D), 600V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3 Small Signal Field-Effect Transistor, 0.021A I(D), 600V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker Infineon Infineon Infineon Infineon Infineon
package instruction SMALL OUTLINE, R-PDSO-G3 SMALL OUTLINE, R-PDSO-G3 SMALL OUTLINE, R-PDSO-G3 SMALL OUTLINE, R-PDSO-G3 SMALL OUTLINE, R-PDSO-G3
Contacts 3 3 3 3 3
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage 600 V 600 V 600 V 600 V 600 V
Maximum drain current (Abs) (ID) 0.021 A 0.021 A 0.021 A 0.021 A 0.021 A
Maximum drain current (ID) 0.021 A 0.021 A 0.021 A 0.021 A 0.021 A
Maximum drain-source on-resistance 500 Ω 500 Ω 500 Ω 500 Ω 500 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Maximum feedback capacitance (Crss) 1.5 pF 1.5 pF 1.5 pF 1.5 pF 1.5 pF
JESD-30 code R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3
JESD-609 code e3 e3 e3 e3 e3
Number of components 1 1 1 1 1
Number of terminals 3 3 3 3 3
Operating mode DEPLETION MODE DEPLETION MODE DEPLETION MODE DEPLETION MODE DEPLETION MODE
Maximum operating temperature 150 °C 150 °C 150 °C 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 260 NOT SPECIFIED NOT SPECIFIED
Polarity/channel type N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
Maximum power dissipation(Abs) 0.5 W 0.5 W 0.5 W 0.5 W 0.5 W
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES
Terminal surface MATTE TIN MATTE TIN MATTE TIN Matte Tin (Sn) MATTE TIN
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED 40 40 NOT SPECIFIED NOT SPECIFIED
Transistor component materials SILICON SILICON SILICON SILICON SILICON
Humidity sensitivity level - 1 1 1 -
Problems with booting Linux from SD card
Recently I need to install a Linux system on this DBM-SoC2 + DBM-SoC2-Base1 board (the default setting is to boot from the SD card, so I want to do this too, without changing the settings, and use a 1...
cyclone5 FPGA/CPLD
Component package dimensions
[i=s] This post was last edited by paulhyde on 2014-9-15 09:45 [/i] I will list the packaging of the components and hope it will be helpful to everyone...
hsuda876 Electronics Design Contest
After the program is full screen, click minimize, the start menu cannot be used
On Windows CE, when the program is maximized when it is started, and then minimized to the tray, the start menu does not work. Other items in the lower right corner can be clicked, but when the progra...
takama Embedded System
Wireless Sensor Network Report - Measurement of RSSI and its relationship with distance
Wireless Sensor Network Report - RSSI Measurement and Its Relationship with Distance 1. Experimental Purpose l Study the quantitative relationship between transmission power, transmission distance, re...
fish001 RF/Wirelessly
Microcomputer instruction problem
Is the instruction wrong? Some pointed out: (1) MOV DS, 117CH (2) MOV [BX], [28A0H] (3) MOV CS, AX (4) MOV DS, ES (5) MOV AL, DX (6) MOV AX, 1000[BX] (7) MOV BX, [AX] (8) MOV AL, C8H (9) MOV AX, 00F1?...
lhysoso Embedded System
Design and implementation of multi-network intelligent remote control system
Abstract: This paper introduces the design idea of a multi-network intelligent remote control system which is based on the single-chip microcomputer AT89C52, dual-tone multi-frequency decoding integra...
frozenviolet Automotive Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1041  2761  2005  2269  2748  21  56  41  46  6 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号