EEWORLDEEWORLDEEWORLD

Part Number

Search

HY29LV160TT-120

Description
Flash, 1MX16, 120ns, PDSO48, TSOP-48
Categorystorage    storage   
File Size542KB,48 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

HY29LV160TT-120 Overview

Flash, 1MX16, 120ns, PDSO48, TSOP-48

HY29LV160TT-120 Parametric

Parameter NameAttribute value
MakerSK Hynix
Parts packaging codeTSOP
package instructionTSOP-48
Contacts48
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time120 ns
Spare memory width8
startup blockTOP
JESD-30 codeR-PDSO-G48
JESD-609 codee6
length18.4 mm
memory density16777216 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN BISMUTH
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
typeNOR TYPE
width12 mm
HY29LV160
16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory
KEY FEATURES
n
Single Power Supply Operation
– Read, program and erase operations from
2.7 to 3.6 volts
– Ideal for battery-powered applications
High Performance
– 70, 80, 90 and 120 ns access time
versions
Ultra-low Power Consumption (Typical
Values At 5 Mhz)
– Automatic sleep mode current: 1 µA
– Standby mode current: 1 µA
– Read current: 9 mA
– Program/erase current: 20 mA
Flexible Sector Architecture:
– One 16 KB, two 8 KB, one 32 KB and
thirty-one 64 KB sectors in byte mode
– One 8 KW, two 4 KW, one 16 KW and
thirty-one 32 KW sectors in word mode
– Top or bottom boot block configurations
available
Sector Protection
– Allows locking of a sector or sectors to
prevent program or erase operations
within that sector
– Sectors lockable in-system or via
programming equipment
– Temporary Sector Unprotect allows
changes in locked sectors (requires high
voltage on RESET# pin)
Fast Program and Erase Times
– Sector erase time: 0.25 sec typical for
each sector
– Chip erase time: 8 sec typical
– Byte program time: 9
µs
typical
Unlock Bypass Program Command
– Reduces programming time when issuing
multiple program command sequences
Automatic Erase Algorithm Preprograms
and Erases Any Combination of Sectors
or the Entire Chip
Erase Suspend/Erase Resume
– Suspends an erase operation to allow
reading data from, or programming data
to, a sector that is not being erased
– Erase Resume can then be invoked to
complete suspended erasure
Automatic Program Algorithm Writes and
Verifies Data at Specified Addresses
n
100,000 Write Cycles per Sector Minimum
n
Data# Polling and Toggle Bits
– Provide software confirmation of
completion of program and erase
operations
Ready/Busy# Pin
– Provides hardware confirmation of
completion of program and erase
operations
Hardware Reset Pin (RESET#) Resets the
Device to Reading Array Data
Compliant With Common Flash Memory
Interface (CFI) Specification
– Flash device parameters stored directly
on the device
– Allows software driver to identify and use
a variety of different current and future
Flash products
Compatible With JEDEC standards
– Pinout and software compatible with
single-power supply Flash devices
– Superior inadvertent write protection
Space Efficient Packaging
– 48-pin TSOP and 48-ball FBGA packages
n
n
n
n
n
n
n
n
n
n
LOGIC DIAGRAM
20
A[19:0]
DQ[7:0]
7
CE#
OE#
WE#
RESET#
BYTE#
DQ[14:8]
DQ15/A-1
RY/BY#
8
n
n
n
n
Preliminary
Revision 1.0, June 2000

HY29LV160TT-120 Related Products

HY29LV160TT-120 HY29LV160BT-120I HY29LV160BT-120 HY29LV160TF-120 HY29LV160TF-120I HY29LV160TT-120I HY29LV160BF-120I HY29LV160BF-120
Description Flash, 1MX16, 120ns, PDSO48, TSOP-48 Flash, 1MX16, 120ns, PDSO48, TSOP-48 Flash, 1MX16, 120ns, PDSO48, TSOP-48 Flash, 1MX16, 120ns, PBGA48, 8 X 9 MM, FBGA-48 Flash, 1MX16, 120ns, PBGA48, 8 X 9 MM, FBGA-48 Flash, 1MX16, 120ns, PDSO48, TSOP-48 Flash, 1MX16, 120ns, PBGA48, 8 X 9 MM, FBGA-48 Flash, 1MX16, 120ns, PBGA48, 8 X 9 MM, FBGA-48
Parts packaging code TSOP TSOP TSOP BGA BGA TSOP BGA BGA
package instruction TSOP-48 TSOP-48 TSOP-48 8 X 9 MM, FBGA-48 8 X 9 MM, FBGA-48 TSOP-48 8 X 9 MM, FBGA-48 8 X 9 MM, FBGA-48
Contacts 48 48 48 48 48 48 48 48
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns 120 ns 120 ns 120 ns 120 ns 120 ns 120 ns 120 ns
Spare memory width 8 8 8 8 8 8 8 8
startup block TOP BOTTOM BOTTOM TOP TOP TOP BOTTOM BOTTOM
JESD-30 code R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PBGA-B48 R-PBGA-B48 R-PDSO-G48 R-PBGA-B48 R-PBGA-B48
JESD-609 code e6 e6 e6 e1 e1 e6 e1 e1
length 18.4 mm 18.4 mm 18.4 mm 9 mm 9 mm 18.4 mm 9 mm 9 mm
memory density 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 48 48 48 48 48 48 48 48
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 70 °C 70 °C 85 °C 85 °C 85 °C 70 °C
organize 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TSOP1 TSOP1 TFBGA TFBGA TSOP1 TFBGA TFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Programming voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface TIN BISMUTH TIN BISMUTH TIN BISMUTH TIN SILVER COPPER TIN SILVER COPPER TIN BISMUTH TIN SILVER COPPER TIN SILVER COPPER
Terminal form GULL WING GULL WING GULL WING BALL BALL GULL WING BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.5 mm 0.8 mm 0.8 mm
Terminal location DUAL DUAL DUAL BOTTOM BOTTOM DUAL BOTTOM BOTTOM
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 12 mm 12 mm 12 mm 8 mm 8 mm 12 mm 8 mm 8 mm
Maker SK Hynix SK Hynix SK Hynix - - SK Hynix SK Hynix SK Hynix
Real Time Clock Issue on FRDM-KL25Z Board Based on Kinetis MKL25Z MCU
Hello, experts. I recently developed a project based on Kinetis L series MCU, and I want to measure the current of Real Time Clock (RTC). I use CodeWarrior 10.3 and Processor Expert. In the project, I...
madokaaukawa NXP MCU
Bear Pai Hongmeng Development Board Review - [Hello World!]
[i=s]This post was last edited by Unseen on 2021-6-20 16:44[/i]Last time we mentioned how to configure the compilation environment from scratch. In fact, the official demo materials of Bear Pi have al...
未见 Programming Basics
Is there any job as free as mine?
I just want to complain here... because I am just idle now, and I open EEWORLD all the timeI'm about to graduate. I was looking for a job but nobody responded. I sent out many resumes but nothing came...
虚V界 Talking about work
I want to use C# to implement media playback in Wince, preferably calling Media Player. I hope experienced seniors can show me some skills to open my eyes. It would be best if there is source code!!
I want to use C# to implement media playback in Wince, preferably calling Media Player. I hope experienced seniors can show me some skills to open my eyes. It would be best if there is source code!!...
云游四海 Embedded System
Regarding the display problem on wince, urgent!!!
I built a C++ MFC for mobile devices in VS2005, which is a 264 decoder. Now I need to add a display program, and it would be best if it can decode and play a little at a time. There was a source progr...
gutouabc123 Embedded System
The open source DAPLink project has been updated
Recently, ARM's open source project DAPLink has been updated a lot. The most important change is that it officially supports STM32F103 as a controller, which means that the ST-Link of the Nucleo devel...
dcexpert DIY/Open Source Hardware

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 204  1003  815  948  2502  5  21  17  20  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号