Page Mode DRAM, 256KX9, 100ns, MOS
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | FUJITSU |
| Parts packaging code | SIMM |
| package instruction | , SIP30,.2 |
| Contacts | 30 |
| Reach Compliance Code | unknown |
| Maximum access time | 100 ns |
| I/O type | COMMON |
| JESD-609 code | e0 |
| memory density | 2359296 bit |
| Memory IC Type | PAGE MODE DRAM |
| memory width | 9 |
| Number of terminals | 30 |
| word count | 262144 words |
| character code | 256000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX9 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| Encapsulate equivalent code | SIP30,.2 |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 256 |
| Maximum seat height | 17.018 mm |
| Maximum slew rate | 0.63 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal pitch | 2.54 mm |
| Terminal location | SINGLE |
| MB85227-10PDPS | MB85227-12PDPB | MB85227-15PDPS | MB85227-15PDPB | MB85227-12PDPS | |
|---|---|---|---|---|---|
| Description | Page Mode DRAM, 256KX9, 100ns, MOS | Page Mode DRAM, 256KX9, 120ns, MOS, PSMA30 | Page Mode DRAM, 256KX9, 150ns, MOS | Page Mode DRAM, 256KX9, 150ns, MOS, PSMA30 | DRAM Module, 256KX9, 120ns, CMOS, SIMM-30 |
| package instruction | , SIP30,.2 | SIMM, SIM30 | , SIP30,.2 | SIMM, SIM30 | , |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 100 ns | 120 ns | 150 ns | 150 ns | 120 ns |
| memory density | 2359296 bit | 2359296 bit | 2359296 bit | 2359296 bit | 2359296 bit |
| Memory IC Type | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | DRAM MODULE |
| memory width | 9 | 9 | 9 | 9 | 9 |
| Number of terminals | 30 | 30 | 30 | 30 | 30 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX9 | 256KX9 | 256KX9 | 256KX9 | 256KX9 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | MOS | MOS | MOS | MOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Maker | FUJITSU | FUJITSU | FUJITSU | FUJITSU | - |
| Parts packaging code | SIMM | SIMM | SIMM | SIMM | - |
| Contacts | 30 | 30 | 30 | 30 | - |
| I/O type | COMMON | COMMON | COMMON | COMMON | - |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| Encapsulate equivalent code | SIP30,.2 | SIM30 | SIP30,.2 | SIM30 | - |
| power supply | 5 V | 5 V | 5 V | 5 V | - |
| refresh cycle | 256 | 256 | 256 | 256 | - |
| Maximum seat height | 17.018 mm | 16.764 mm | 17.018 mm | 16.764 mm | - |
| Maximum slew rate | 0.63 mA | 0.585 mA | 0.513 mA | 0.513 mA | - |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
| JESD-30 code | - | R-PSMA-N30 | - | R-PSMA-N30 | R-XSMA-T30 |
| Package shape | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | - | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Terminal form | - | NO LEAD | - | NO LEAD | THROUGH-HOLE |
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