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KS74AHCT682N

Description
Magnitude Comparator, CMOS, PDIP20
Categorylogic    logic   
File Size496KB,8 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KS74AHCT682N Overview

Magnitude Comparator, CMOS, PDIP20

KS74AHCT682N Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
package instructionDIP, DIP20,.3
Reach Compliance Codecompliant
JESD-30 codeR-PDIP-T20
JESD-609 codee0
Logic integrated circuit typeMAGNITUDE COMPARATOR
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

KS74AHCT682N Related Products

KS74AHCT682N KS74AHCT682J KS54AHCT684J KS74AHCT684N KS74AHCT684J
Description Magnitude Comparator, CMOS, PDIP20 Magnitude Comparator, CMOS, CDIP20 Magnitude Comparator, CMOS, CDIP20 Magnitude Comparator, CMOS, PDIP20 Magnitude Comparator, CMOS, CDIP20
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG
package instruction DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3
Reach Compliance Code compliant compliant compliant compliant compliant
JESD-30 code R-PDIP-T20 R-XDIP-T20 R-XDIP-T20 R-PDIP-T20 R-XDIP-T20
JESD-609 code e0 e0 e0 e0 e0
Logic integrated circuit type MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR
Number of terminals 20 20 20 20 20
Maximum operating temperature 85 °C 85 °C 125 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -55 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC
encapsulated code DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
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