Standard SRAM, 128KX8, 20ns, CMOS, CQCC32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | IXYS |
| Reach Compliance Code | unknown |
| Maximum access time | 20 ns |
| I/O type | COMMON |
| JESD-30 code | R-XQCC-N32 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC32,.45X.55 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.0005 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.175 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| PDM41024L20L32I | PDM41024S25L32 | PDM41024S20L32I | |
|---|---|---|---|
| Description | Standard SRAM, 128KX8, 20ns, CMOS, CQCC32 | Standard SRAM, 128KX8, 25ns, CMOS, CQCC32 | Standard SRAM, 128KX8, 20ns, CMOS, CQCC32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | IXYS | IXYS | IXYS |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum access time | 20 ns | 25 ns | 20 ns |
| I/O type | COMMON | COMMON | COMMON |
| JESD-30 code | R-XQCC-N32 | R-XQCC-N32 | R-XQCC-N32 |
| JESD-609 code | e0 | e0 | e0 |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 |
| Number of terminals | 32 | 32 | 32 |
| word count | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C |
| Minimum operating temperature | -40 °C | - | -40 °C |
| organize | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QCCN | QCCN | QCCN |
| Encapsulate equivalent code | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.0005 A | 0.01 A | 0.01 A |
| Minimum standby current | 2 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.175 mA | 0.17 mA | 0.18 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD |
京公网安备 11010802033920号
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