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PDM41024S25L32

Description
Standard SRAM, 128KX8, 25ns, CMOS, CQCC32
Categorystorage    storage   
File Size312KB,8 Pages
ManufacturerIXYS
Download Datasheet Parametric Compare View All

PDM41024S25L32 Overview

Standard SRAM, 128KX8, 25ns, CMOS, CQCC32

PDM41024S25L32 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIXYS
Reach Compliance Codeunknown
Maximum access time25 ns
I/O typeCOMMON
JESD-30 codeR-XQCC-N32
JESD-609 codee0
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.01 A
Minimum standby current4.5 V
Maximum slew rate0.17 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Base Number Matches1

PDM41024S25L32 Related Products

PDM41024S25L32 PDM41024L20L32I PDM41024S20L32I
Description Standard SRAM, 128KX8, 25ns, CMOS, CQCC32 Standard SRAM, 128KX8, 20ns, CMOS, CQCC32 Standard SRAM, 128KX8, 20ns, CMOS, CQCC32
Is it Rohs certified? incompatible incompatible incompatible
Maker IXYS IXYS IXYS
Reach Compliance Code unknown unknown unknown
Maximum access time 25 ns 20 ns 20 ns
I/O type COMMON COMMON COMMON
JESD-30 code R-XQCC-N32 R-XQCC-N32 R-XQCC-N32
JESD-609 code e0 e0 e0
memory density 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8
Number of terminals 32 32 32
word count 131072 words 131072 words 131072 words
character code 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C
organize 128KX8 128KX8 128KX8
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC
encapsulated code QCCN QCCN QCCN
Encapsulate equivalent code LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum standby current 0.01 A 0.0005 A 0.01 A
Minimum standby current 4.5 V 2 V 4.5 V
Maximum slew rate 0.17 mA 0.175 mA 0.18 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD

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