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PDM44026S12TQ

Description
Cache SRAM, 32KX36, 12ns, CMOS, PQFP100
Categorystorage    storage   
File Size532KB,11 Pages
ManufacturerParadigm Technology Inc
Download Datasheet Parametric Compare View All

PDM44026S12TQ Overview

Cache SRAM, 32KX36, 12ns, CMOS, PQFP100

PDM44026S12TQ Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerParadigm Technology Inc
package instructionQFP, QFP100,.63X.87
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time12 ns
Other featuresBYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
memory density1179648 bit
Memory IC TypeCACHE SRAM
memory width36
Number of functions1
Number of ports1
Number of terminals100
word count32768 words
character code32000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX36
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3/5,5 V
Certification statusNot Qualified
Maximum standby current0.08 A
Minimum standby current4.75 V
Maximum slew rate0.4 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED

PDM44026S12TQ Related Products

PDM44026S12TQ PDM44026S12TQI PDM44026S14TQ PDM44026S14TQI
Description Cache SRAM, 32KX36, 12ns, CMOS, PQFP100 Cache SRAM, 32KX36, 12ns, CMOS, PQFP100 Cache SRAM, 32KX36, 14ns, CMOS, PQFP100 Cache SRAM, 32KX36, 14ns, CMOS, PQFP100
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Paradigm Technology Inc Paradigm Technology Inc Paradigm Technology Inc Paradigm Technology Inc
package instruction QFP, QFP100,.63X.87 QFP, QFP100,.63X.87 QFP, QFP100,.63X.87 QFP, QFP100,.63X.87
Reach Compliance Code unknown unknown unknown unknow
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 12 ns 12 ns 14 ns 14 ns
Other features BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609 code e0 e0 e0 e0
memory density 1179648 bit 1179648 bit 1179648 bit 1179648 bi
Memory IC Type CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
memory width 36 36 36 36
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 100 100 100 100
word count 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 70 °C 85 °C
organize 32KX36 32KX36 32KX36 32KX36
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP QFP QFP
Encapsulate equivalent code QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3/5,5 V 3.3/5,5 V 3.3/5,5 V 3.3/5,5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Minimum standby current 4.75 V 4.75 V 4.75 V 4.75 V
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.635 mm 0.635 mm 0.635 mm 0.635 mm
Terminal location QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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