AM29LV160MT70EI datasheet, PDF

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AM29LV160MT70EI: DescriptionFlash, 1MX16, 70ns, PDSO48, MO-142B, TSOP-48; Categorystorage storage; File Size1MB，53 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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AM29LV160MT70EI Overview

Flash, 1MX16, 70ns, PDSO48, MO-142B, TSOP-48

AM29LV160MT70EI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	TSOP1
package instruction	TSOP1, TSSOP48,.8,20
Contacts	48
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	70 ns
Other features	TOP BOOT BLOCK
Spare memory width	8
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G48
JESD-609 code	e0
length	18.4 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	1,2,1,31
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP48,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	16K,8K,32K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
switch bit	YES
type	NOR TYPE
width	12 mm

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ADVANCE INFORMATION

Am29LV160M

16 Megabit (2 M x 8-Bit/1 M x 16-Bit) MirrorBit

3.0 Volt-only Boot Sector Flash Memory

DISTINCTIVE CHARACTERISTICS

ARCHITECTURAL ADVANTAGES

■

Low power consumption (typical values at 5 MHz)

—

400 nA standby mode current

15 mA read current

40 mA program/erase current

400 nA Automatic Sleep mode current

■

Single power supply operation

— 3 V for read, erase, and program operations

■

Manufactured on 0.23 µm MirrorBit

process

technology

— Fully compatible with Am29LV160D device

■

Package options

— 48-ball Fine-pitch BGA

— 64-ball Fortified BGA

— 48-pin TSOP

SOFTWARE & HARDWARE FEATURES

■

SecSi (Secured Silicon) Sector region

— 128-word/256-byte sector for permanent, secure

identification through an 8-word/16-byte random

Electronic Serial Number, accessible through a

command sequence

— May be programmed and locked at the factory or by

the customer

■

Software features

— Program Suspend & Resume: read other sectors

before programming operation is completed

— Erase Suspend & Resume: read/program other

sectors before an erase operation is completed

— Data# polling & toggle bits provide status

— Unlock Bypass Program command reduces overall

multiple-word programming time

— CFI (Common Flash Interface) compliant: allows host

system to identify and accommodate multiple flash

devices

■

Flexible sector architecture

— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and thirty-

one 64 Kbyte sectors (byte mode)

— One 8 Kword, two 4 Kword, one 16 Kword, and thirty-

one 32 Kword sectors (word mode)

■

Compatibility with JEDEC standards

— Provides pinout and software compatibility for single-

power supply flash, and superior inadvertent write

protection

■

Top or bottom boot block configurations available

■

Minimum 100,000 erase cycle guarantee per sector

■

20-year data retention at 125°C

PERFORMANCE CHARACTERISTICS

■

Hardware features

— Sector Protection: hardware-level method of

preventing write operations within a sector

— Temporary Sector Unprotect: V

-level method of

changing code in locked sectors

— Hardware reset input (RESET#) resets device

— Ready/Busy# output (RY/BY#) indicates program or

erase cycle completion

■

High performance

— Access times as fast as 70 ns

— 0.4 s typical sector erase time

This Data Sheet states AMD’s current technical specifications regarding the Product described herein. This Data

Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.

Publication#

25974

Rev:

Amendment/+3

Issue Date:

January 6, 2003

A D V A N C E

I N F O R M A T I O N

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29LV160M Device Bus Operations ..............................10

Command Definitions ............................................................. 27

Write Operation Status . . . . . . . . . . . . . . . . . . . . 29

DQ7: Data# Polling ................................................................. 29

Figure 7. Data# Polling Algorithm .................................................. 29

RY/BY#: Ready/Busy# ............................................................ 30

DQ6: Toggle Bit I .................................................................... 30

DQ2: Toggle Bit II ................................................................... 30

Reading Toggle Bits DQ6/DQ2 ............................................... 30

Figure 8. Toggle Bit Algorithm........................................................ 31

Word/Byte Configuration ........................................................ 10

Requirements for Reading Array Data ................................... 10

Writing Commands/Command Sequences ............................ 11

Program and Erase Operation Status .................................... 11

Standby Mode ........................................................................ 11

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 12

Output Disable Mode .............................................................. 12

Table 2. Sector Address Tables (Am29LV160MT) .........................13

Table 3. Sector Address Tables (Am29LV160MB) .........................14

DQ5: Exceeded Timing Limits ................................................ 32

DQ3: Sector Erase Timer ....................................................... 32

Table 12. Write Operation Status ................................................... 32

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33

Figure 9. Maximum Negative Overshoot Waveform ...................... 33

Figure 10. Maximum Positive Overshoot Waveform...................... 33

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 33

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 11. Test Setup..................................................................... 35

Table 13. Test Specifications ......................................................... 35

Figure 12. Input Waveforms and Measurement Levels ................. 35

Autoselect Mode ..................................................................... 15

Table 4. Am29LV160M Autoselect Codes (High Voltage Method) .15

Sector Protection/Unprotection ............................................... 15

Temporary Sector Unprotect .................................................. 15

Figure 1. Temporary Sector Unprotect Operation........................... 16

Figure 2. In-System Single High Voltage Sector Protect/Unprotect Al-

gorithms .......................................................................................... 17

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 36

Read Operations .................................................................... 36

Figure 13. Read Operations Timings ............................................. 36

Hardware Reset (RESET#) .................................................... 37

Figure 14. RESET# Timings .......................................................... 37

SecSi (Secured Silicon) Sector Flash Memory Region .......... 18

Table 5. SecSi Sector Addressing ..................................................18

Figure 3. SecSi Sector Protect Verify.............................................. 19

Word/Byte Configuration (BYTE#) ........................................ 38

Figure 15. BYTE# Timings for Read Operations............................ 38

Figure 16. BYTE# Timings for Write Operations............................ 38

Common Flash Memory Interface (CFI) ................................. 19

Table 6. CFI Query Identification String ..........................................19

Table 7. System Interface String .....................................................20

Table 8. Device Geometry Definition ..............................................20

Table 9. Primary Vendor-Specific Extended Query ........................21

Erase/Program Operations ..................................................... 39

Figure 17. Program Operation Timings..........................................

Figure 18. Chip/Sector Erase Operation Timings ..........................

Figure 19. Data# Polling Timings (During Embedded Algorithms).

Figure 20. Toggle Bit Timings (During Embedded Algorithms)......

Figure 21. DQ2 vs. DQ6 for Erase and

Erase Suspend Operations ............................................................

Figure 22. Temporary Sector Unprotect/Timing Diagram ..............

Figure 23. Sector Protect/Unprotect Timing Diagram ....................

Figure 24. Alternate CE# Controlled Write Operation Timings ......

Hardware Data Protection ...................................................... 21

Low V

Write Inhibit .............................................................. 21

Write Pulse “Glitch” Protection ............................................... 21

Logical Inhibit .......................................................................... 21

Power-Up Write Inhibit ............................................................ 21

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 22

Reading Array Data ................................................................ 22

Reset Command ..................................................................... 22

Autoselect Command Sequence ............................................ 22

Word/Byte Program Command Sequence ............................. 22

Unlock Bypass Command Sequence ..................................... 23

Figure 4. Program Operation .......................................................... 23

Chip Erase Command Sequence ........................................... 23

Sector Erase Command Sequence ........................................ 24

Erase Suspend/Erase Resume Commands ........................... 24

Figure 5. Erase Operation............................................................... 25

Program Suspend/Program Resume Command Sequence ... 26

Figure 6. Program Suspend/Program Resume............................... 26

Erase and Programming Performance . . . . . . . 47

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 47

TSOP Pin and BGA Package Capacitance . . . . . 47

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 48

TS 048—48-Pin Standard TSOP ............................................ 48

TSR048—48-Pin Reverse TSOP ........................................... 49

FBA048—48-Ball Fine-Pitch Ball Grid Array (BGA)

6 x 8 mm Package .................................................................. 50

LAA064—64-Ball Fortified Ball Grid Array (FBGA) 13 x 11 mm

Package .................................................................................. 51

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52

January 6, 2003

Am29LV160M

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