SAK-TC1796-256F150EBC datasheet, PDF

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SAK-TC1796-256F150EBC: DescriptionMicrocontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA416, PLASTIC, BGA-416; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，136 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/

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SAK-TC1796-256F150EBC Overview

Microcontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA416, PLASTIC, BGA-416

SAK-TC1796-256F150EBC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Infineon
Parts packaging code	BGA
package instruction	PLASTIC, BGA-416
Contacts	416
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Factory Lead Time	1 week
Has ADC	YES
Address bus width	24
bit size	32
maximum clock frequency	40 MHz
DAC channel	NO
DMA channel	YES
External data bus width	32
JESD-30 code	S-PBGA-B416
length	27 mm
Humidity sensitivity level	3
Number of I/O lines	127
Number of terminals	416
Maximum operating temperature	125 °C
Minimum operating temperature	-10 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA416,26X26,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	250
power supply	1.5,2.5/3.3,3.3 V
Certification status	Not Qualified
RAM (bytes)	65536
rom(word)	131072
ROM programmability	FLASH
Maximum seat height	2.5 mm
speed	150 MHz
Maximum supply voltage	1.58 V
Minimum supply voltage	1.42 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

SAK-TC1796-256F150EBC Preview

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TC1796

3 2 - B i t S i n g l e - C h i p M i c ro c o n t r o ll e r

TriCore

M i c r o c o n t r o l l e rs

Edition 2008-04

Published by

Infineon Technologies AG

81726 Munich, Germany

2008 Infineon Technologies AG

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any

information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties

and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights

of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the types in

question, please contact the nearest Infineon Technologies Office.

Infineon Technologies components may be used in life-support devices or systems only with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

be endangered.

D a ta S he e t , V 1 .0 , Ap r . 2 0 0 8

TC1796

3 2 - B i t S i n g l e - C h i p M i c ro c o n t r o ll e r

TriCore

M i c r o c o n t r o l l e rs

TC1796

TC1796 Data Sheet

Revision History: V1.0, 2008-04

Previous Version: V1.0, 2008-04 “Preliminary”

Page

Subjects (major changes since last revision)

“Preliminary” status removed. No changes in content.

Changes from V0.7, 2006-03 to V1.0, 2008-04 Preliminary

107

115

126

131

133

Trademarks

TriCore® is a trademark of Infineon Technologies AG.

We Listen to Your Comments

Any information within this document that you feel is wrong, unclear or missing at all?

Your feedback will help us to continuously improve the quality of this document.

Please send your proposal (including a reference to this document) to:

mcdocu.comments@infineon.com

The list of not connected pins (N.C.) improved by adding several

formerly as

labeled pins.

Watchdog timer, double reset detection, description corrected.

RTID register updated for the design step BE.

The description of the inactive device current improved.

ADC parameters sample and conversion time moved to a dedicated

table.

The description of the power supply sequence improved..

BFCLKO clock, duty cycle description extended.

MLI timing, maximum operating frequency limit extended, t31 added.

The drawing of the package updated.

Green package variant included.

Example of a temperature profile corrected.

Data Sheet

V1.0, 2008-04

TC1796

Table of Contents

2.1

2.2

2.3

2.4

2.5

2.5.1

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

3.10

3.11

3.12

3.13

3.14

3.14.1

3.14.2

3.15

3.16

3.17

3.18

3.19

3.20

3.21

3.22

3.23

3.24

3.25

4.1

4.1.1

Data Sheet

Summary of Features

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

General Device Information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TC1796 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Pad Driver and Input Classes Overview . . . . . . . . . . . . . . . . . . . . . . . . . .

Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Pull-Up/Pull-Down Behavior of the Pins . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Architecture and On-Chip Bus Systems . . . . . . . . . . . . . . . . . . . .

On-Chip Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Architectural Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Memory Protection System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

External Bus Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Peripheral Control Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DMA Controller and Memory Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1) . . . . . . . . . .

High-Speed Synchronous Serial Interfaces (SSC0, SSC1) . . . . . . . . . . . .

Micro Second Bus Interfaces (MSC0, MSC1) . . . . . . . . . . . . . . . . . . . . . .

MultiCAN Controller (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Micro Link Serial Bus Interface (MLI0, MLI1) . . . . . . . . . . . . . . . . . . . . . . .

General Purpose Timer Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functionality of GPTA0/GPTA1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functionality of LTCA2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Analog-to-Digital Converter (ADC0, ADC1) . . . . . . . . . . . . . . . . . . . . . . . .

Fast Analog-to-Digital Converter Unit (FADC) . . . . . . . . . . . . . . . . . . . . . .

System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Boot Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Management System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Clock Generation and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Identification Register Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrical Parameters

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

V1.0, 2008-04

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SAK-TC1796-256F150EBC Related Products

	SAK-TC1796-256F150EBC	SAK-TC1796-256F150EBE	SAK-TC1796-256F150EBD
Description	Microcontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA416, PLASTIC, BGA-416	Microcontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA416, PLASTIC, BGA-416	Microcontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA416, ROHS COMPLIANT, PLASTIC, BGA-416
Is it Rohs certified?	incompatible	conform to	conform to
Maker	Infineon	Infineon	Infineon
Parts packaging code	BGA	BGA	BGA
package instruction	PLASTIC, BGA-416	BGA, BGA416,26X26,40	BGA, BGA416,26X26,40
Contacts	416	416	416
Reach Compliance Code	compliant	compliant	unknown
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2
Has ADC	YES	YES	YES
Address bus width	24	24	24
bit size	32	32	32
maximum clock frequency	40 MHz	40 MHz	40 MHz
DAC channel	NO	NO	NO
DMA channel	YES	YES	YES
External data bus width	32	32	32
JESD-30 code	S-PBGA-B416	S-PBGA-B416	S-PBGA-B416
length	27 mm	27 mm	27 mm
Number of I/O lines	127	127	127
Number of terminals	416	416	416
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-10 °C	-10 °C	-10 °C
PWM channel	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA
Encapsulate equivalent code	BGA416,26X26,40	BGA416,26X26,40	BGA416,26X26,40
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	250	250	NOT SPECIFIED
power supply	1.5,2.5/3.3,3.3 V	1.5,2.5/3.3,3.3 V	1.5,2.5/3.3,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	65536	65536	65536
rom(word)	131072	2097152	2097152
ROM programmability	FLASH	FLASH	FLASH
Maximum seat height	2.5 mm	2.5 mm	2.5 mm
speed	150 MHz	150 MHz	150 MHz
Maximum supply voltage	1.58 V	1.58 V	1.58 V
Minimum supply voltage	1.42 V	1.42 V	1.42 V
Nominal supply voltage	1.5 V	1.5 V	1.5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER
Terminal form	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	27 mm	27 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Factory Lead Time	1 week	1 week	-
Humidity sensitivity level	3	3	-
Maximum slew rate	-	700 mA	700 mA

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