ECCM7AA08-13.824M datasheet, PDF

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ECCM7AA08-13.824M: DescriptionQUARTZ CRYSTAL RESONATOR, 13.824MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN; CategoryPassive components Crystal/resonator; File Size121KB，4 Pages; ManufacturerECLIPTEK; Websitehttp://www.ecliptek.com; Environmental Compliance

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ECCM7AA08-13.824M Overview

QUARTZ CRYSTAL RESONATOR, 13.824MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

ECCM7AA08-13.824M Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ECLIPTEK
package instruction	ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
Reach Compliance Code	compliant
Other features	AT-CUT CRYSTAL; BULK
Ageing	3 PPM/YEAR
Crystal/Resonator Type	PARALLEL - FUNDAMENTAL
Drive level	100 µW
frequency stability	0.005%
frequency tolerance	50 ppm
JESD-609 code	e4
load capacitance	8 pF
Manufacturer's serial number	ECCM7
Installation features	SURFACE MOUNT
Nominal operating frequency	13.824 MHz
Maximum operating temperature	60 °C
Minimum operating temperature	-10 °C
physical size	L3.2XB2.5XH0.8 (mm)/L0.126XB0.098XH0.031 (inch)
Series resistance	100 Ω
surface mount	YES
Terminal surface	Nickel/Gold (Ni/Au)

ECCM7AA08-13.824M Preview

ECCM7AA08-13.824M

Series

RoHS Compliant (Pb-free) 2.5mm x 3.2mm Ceramic

SMD Crystal

Frequency Tolerance/Stability

±50ppm at 25°C, ±50ppm over -10°C to +60°C

Mode of Operation

AT-Cut Fundamental

RoHS

ECCM7 A A 08 -13.824M

Nominal Frequency

13.824MHz

Load Capacitance

8pF Parallel Resonant

ELECTRICAL SPECIFICATIONS

Nominal Frequency

Frequency Tolerance/Stability

Aging at 25°C

Load Capacitance

Shunt Capacitance (C0)

Equivalent Series Resistance

Mode of Operation

Drive Level

Crystal Cut

Spurious Response

Storage Temperature Range

Insulation Resistance

13.824MHz

±50ppm at 25°C, ±50ppm over -10°C to +60°C

±3ppm/Year Maximum

8pF Parallel Resonant

5pF Maximum

100 Ohms Maximum

AT-Cut Fundamental

100µWatts Maximum

AT-Cut

>3dB (from Fo to Fo +5000ppm)

-40°C to +85°C

500 Megaohms Minimum at 100Vdc

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

Fine Leak Test

Flammability

Gross Leak Test

Mechanical Shock

Moisture Resistance

Moisture Sensitivity

Resistance to Soldering Heat

Resistance to Solvents

Solderability

Temperature Cycling

Vibration

MIL-STD-883, Method 3015, Class 1, HBM: 1500V

MIL-STD-883, Method 1014, Condition A

UL94-V0

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 1004

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 2007, Condition A

MECHANICAL DIMENSIONS (all dimensions in millimeters)

CONNECTION

Crystal

Cover/Ground

Crystal

Cover/Ground

2.50

±0.10

MARKING

ORIENTATION

0.70 ±0.10

1.20

±0.10

0.90 ±0.10

(X4)

1.00

±0.10

(X4)

LINE MARKING

E13.8

E=Ecliptek Designator

XXXXX

XXXXX=Ecliptek

Manufacturing Identifier

3.20

±0.10

0.80 MAX

www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 1 of 4

ECCM7AA08-13.824M

Suggested Solder Pad Layout

All Dimensions in Millimeters

1.3 (X4)

0.8

Solder Land

(X4)

0.4

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 2 of 4

ECCM7AA08-13.824M

Recommended Solder Reflow Methods

Critical Zone

to T

Ramp-up

Ramp-down

Temperature (T)

Max

Min

Preheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

MAX to T

(Ramp-up Rate)

Preheat

- Temperature Minimum (T

MIN)

- Temperature Typical (T

TYP)

- Temperature Maximum (T

MAX)

- Time (t

MIN)

Ramp-up Rate (T

to T

)

Time Maintained Above:

- Temperature (T

)

- Time (t

)

Peak Temperature (T

)

Target Peak Temperature (T

Target)

Time within 5°C of actual peak (t

)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

3°C/second Maximum

150°C

175°C

200°C

60 - 180 Seconds

3°C/second Maximum

217°C

60 - 150 Seconds

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 3 of 4

ECCM7AA08-13.824M

Recommended Solder Reflow Methods

Critical Zone

to T

Ramp-up

Ramp-down

Temperature (T)

Max

Min

Preheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 245°C

MAX to T

(Ramp-up Rate)

Preheat

- Temperature Minimum (T

MIN)

- Temperature Typical (T

TYP)

- Temperature Maximum (T

MAX)

- Time (t

MIN)

Ramp-up Rate (T

to T

)

Time Maintained Above:

- Temperature (T

)

- Time (t

)

Peak Temperature (T

)

Target Peak Temperature (T

Target)

Time within 5°C of actual peak (t

)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

5°C/second Maximum

N/A

150°C

N/A

30 - 60 Seconds

5°C/second Maximum

150°C

200 Seconds Maximum

245°C Maximum

245°C Maximum 2 Times / 230°C Maximum 1 Time

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 4 of 4

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