
Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Data Delay Devices |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 14 |
| Reach Compliance Code | compliant |
| Other features | TESTED WITH NO LOAD CONDITIONS; MIN. FAN OUT OF 10 LSTTL LOADS |
| series | HC/UH |
| Input frequency maximum value (fmax) | 22.2222 MHz |
| JESD-30 code | R-XDIP-T8 |
| JESD-609 code | e3 |
| Logic integrated circuit type | ACTIVE DELAY LINE |
| Number of functions | 3 |
| Number of taps/steps | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output polarity | TRUE |
| Package body material | UNSPECIFIED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| programmable delay line | NO |
| Certification status | Not Qualified |
| Maximum seat height | 7.747 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin (Sn) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Total delay nominal (td) | 15 ns |
| width | 7.62 mm |

| MDU-3C-15 | MDU-3C-25 | MDU-3C-30 | MDU-3C-20 | MDU-3C-40 | MDU-3C-50 | MDU-3C-60 | MDU-3C-75 | MDU-3C-100 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
| Contacts | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compli | compli | compli |
| Other features | TESTED WITH NO LOAD CONDITIONS; MIN. FAN OUT OF 10 LSTTL LOADS | TESTED WITH NO LOAD CONDITIONS; MIN. FAN OUT OF 10 LSTTL LOADS | TESTED WITH NO LOAD CONDITIONS; MIN. FAN OUT OF 10 LSTTL LOADS | TESTED WITH NO LOAD CONDITIONS; MIN. FAN OUT OF 10 LSTTL LOADS | TESTED WITH NO LOAD CONDITIONS; MIN. FAN OUT OF 10 LSTTL LOADS | TESTED WITH NO LOAD CONDITIONS; MIN. FAN OUT OF 10 LSTTL LOADS | TESTED WITH NO LOAD CONDITIONS; MIN. FAN OUT OF 10 LSTTL LOADS | TESTED WITH NO LOAD CONDITIONS; MIN. FAN OUT OF 10 LSTTL LOADS | TESTED WITH NO LOAD CONDITIONS; MIN. FAN OUT OF 10 LSTTL LOADS |
| series | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| Input frequency maximum value (fmax) | 22.2222 MHz | 13.3333 MHz | 11.1111 MHz | 16.6667 MHz | 8.33333 MHz | 6.66667 MHz | 5.55556 MHz | 4.44444 MHz | 3.33333 MHz |
| JESD-30 code | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| Logic integrated circuit type | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE |
| Number of functions | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of taps/steps | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| programmable delay line | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 7.747 mm | 7.747 mm | 7.747 mm | 7.747 mm | 7.747 mm | 7.747 mm | 7.747 mm | 7.747 mm | 7.747 mm |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Total delay nominal (td) | 15 ns | 25 ns | 30 ns | 20 ns | 40 ns | 50 ns | 60 ns | 75 ns | 100 ns |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |