Performance specification
Characteristics
Limits
Test Methods (JIS - C - 5201-1)
Natural resistance change per temp. degree centigrade
Temperature
coefficient
±300 PPM/°C Max.
<20 O ± 400 PPM/°C
R2-R1
6
X 10 (PPM/°C)
R1(t2-t1)
RoHS
Compliant
R1: Resistance value at room temperature (t1)
R2: Resistance value at room temp. plus 100°C (t2)
Resistance change rate is:
± (2.0 % + 0.05
Ω
) Max.
Permanent resistance change after the application
of a potential of 2.5 times RCWV for 5 seconds
-Direct Load:
Resistance to a 2.5kgs direct load for 10sec. in the
direction of the longitudinal axis of the terminal leads.
-Twist test:
Terminal leads shall be bent throught 90° at a point of
about 6mm from the body of the resistor and shall be
rotated through 360° about the original axis of the bent
terminal in alternating direction for a total of 3 rotations.
Short time overload
Short time overload
No Evidence of mechanical
damage
Resistance change after continuous 5 cycles for
duty cycle specified below:
Temperature cycling
± (0.5 % + 0.05Ù) Max.
Step Temperature
1
-55°C ±3°C
2
Room temp.
3
-155°C ±2°C
4
Room temp.
Time
30 mins
10 ~ 15 mins
30 mins
10 ~ 15 mins
Load life in humidity
Resistance change rate is
± (5.0 % + 0.05
Ω
) Max.
Resistance change after 1,000 hours (1.5 hours
"on", 0.5
hour "off" ) at RCWV in a humidity chamber controlled at
40°C ±2°C and 90 to 95 % relative humidiity
Permanent resistance change after 1,000 hours operating
at RCWV, with duty cycle of (1.5 hours"on", 0.5 hour
"off") at 70°C ±2°C ambient
Permanent resistance change when
leads immersed to 3.2 to 4.8 mm
from the body in 350°C ± 10°C
solder for 3± 0.5 seconds.
Load Life
Resistance change rate is
± (5.0 % + 0.05
Ω
) Max.
Resistance to
Soldering Heat
Resistance change rate is
± (1% + 0.05
Ω
) Max. with no
evidence of mechanical damage.
Solderability
95 % coverage Min.
Test temperature of solder : 245 °C ± 3°C
Dwell time in solder : 2 - 3 seconds
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