General Purpose Inductor, 330uH, 20%, 1 Element, Ferrite-Core, SMD, HALOGEN FREE AND ROHS COMPLIANT
UP2UC-331-R Parametric
Parameter Name
Attribute value
Is it lead-free?
Lead free
Is it Rohs certified?
conform to
Maker
Cooper Industries
Reach Compliance Code
unknown
ECCN code
EAR99
core material
FERRITE
DC Resistance
1.02 Ω
Nominal inductance(L)
330 µH
Inductor Applications
POWER INDUCTOR
Inductor type
GENERAL PURPOSE INDUCTOR
Manufacturer's serial number
UP2UC
Number of functions
1
Number of terminals
2
Maximum operating temperature
125 °C
Minimum operating temperature
-40 °C
self resonant frequency
4.5 MHz
Shape/Size Description
RECTANGULAR PACKAGE
shield
NO
surface mount
YES
Terminal location
DUAL ENDED
Terminal shape
WRAPAROUND
Test frequency
0.1 MHz
Tolerance
20%
UP2UC-331-R Preview
High Power, Drum Inductors
UNI-PAC™ UP2UC Series
Applications
•
•
•
•
•
•
•
Buck or boost inductor
PDAs
Desktop computer
DVD Players
Portable power devices
Output filter chokes
Test equipment instrumentation
HF
FREE
HALOGEN
SMD Device
Description
•
•
•
•
•
•
Halogen Free, RoHS compliant
125°C maximum total temperature operation
9.5 x 12.7 x 5.21mm drum core
Ferrite core material
Inductance range from 1.0μH to 1000μH
Current range from 0.30 to 9.0 amps
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 600 parts per reel,
13” diameter reel
Product Specifications
OCL
Part Number
UP2UC-1R0-R
UP2UC-1R5-R
UP2UC-2R2-R
UP2UC-3R3-R
UP2UC-4R7-R
UP2UC-6R8-R
UP2UC-100-R
UP2UC-150-R
UP2UC-220-R
UP2UC-330-R
UP2UC-470-R
UP2UC-680-R
UP2UC-101-R
UP2UC-151-R
UP2UC-221-R
UP2UC-331-R
UP2UC-471-R
UP2UC-681-R
UP2UC-102-R
5
1
µH ± 20%
1.0
1.5
2.2
3.3
4.7
6.8
10.0
15.0
22.0
33.0
47.0
68.0
100
150
220
330
470
680
1000
Irms
Amps
6.8
6.4
6.1
5.4
4.8
4.4
3.9
3.1
2.7
2.1
1.8
1.5
1.3
1.0
0.80
0.60
0.50
0.40
0.30
2
Isat
3
Amps@25°C
9.0
8.0
7.0
6.4
5.4
4.6
3.8
3.0
2.6
2.0
1.6
1.4
1.2
1.0
0.80
0.60
0.50
0.40
0.30
SRF MHz
Typical
100
90.0
80.0
65.0
45.0
38.0
30.0
27.0
19.0
15.0
12.0
10.0
9.0
6.0
5.0
4.5
3.5
2.5
2.0
DCR mΩ@20°C
Typical
4.0
4.4
5.8
9.9
12.0
25.8
25.9
35.4
55.9
81.6
120
145
211
347
491
750
1188
1811
2757
DCR mΩ@20°C
Maximum
9.0
10.0
12.0
15.0
18.0
27.0
38.0
46.0
85.0
100
140
200
280
400
610
1020
1270
2020
3000
K-factor
4
216
177
130
114
92.52
77.72
62.68
49.82
41.34
34.09
29.00
24.59
20.89
15.80
13.04
10.85
9.39
7.56
6.13
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc
2 Irms: DC current for an approximate
ΔT
rise of 40°C without core loss. Derating is necessary for
AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generat-
ing components will affect the temperature rise. It is recommended the part temperature not
exceed 125°C under worst case operating conditions verified in the end application.
3 Isat: Peak current for approximately 7.5% rolloff at 25°C.
4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI
, Bp-p: (Gauss),
K: (K-factor from table), L: (inductance in
μH), ΔI
(peak-to-peak ripple current in amps).
6 Part Number Definition: UP2CU-xxx-R
• UP2CU = Product code and size
• xxx= Inductance value in
μH,
R = decimal point. If no R is present, then third digit
equals the number of zeros.
• “-R” suffix = RoHS compliant
0609
BU09493
Page 1 of 4
Data Sheet: 4369
Dimensions - mm
Tolerances are ±0.254mm unless otherwise specified.
Top V iew
9.3
±0.2
S ide V iew
5.21
m ax
2.54
±0.2
B ottom V iew
R ecom m ended P ad Layout
2.79
ref
S chem atic
12.7
±0.25
U P 2U C -
xxx
w w llyy R
1
2
Part Marking: UP2UC
1
8.4
±0.15
2.54
±0.2
7.62 typ
7.62
ref
2
2.92
ref
xxx = Inductance value in
μH
(R = Decimal point). If no “R” is present, then the third digit equals the number of zeros.
wwllyy = Date code
R = Revision level
Packaging Information - mm
4.0
2.0
16
1.5 dia.
1.75
11.5
24 ±0.30
13.4
UP2UC-
xxx
wwllyy R
UP2UC-
xxx
wwllyy R
UP2UC-
xxx
wwllyy R
5.5
Section A-A
4.40
9.70
User direction of feed
Supplied in tape-and-reel packaging, 600 parts per reel, 13” diameter reel.
Temperature Rise vs. Total Loss
60
T e m p e ra tu re R is e (°C )
50
40
30
20
10
0
0
0.1
0.2
0.3
0.4
0.5
0.6
To ta l L o s s (W )
0609
BU09493
Page 2 of 4
Data Sheet: 4369
Core Loss
C o r e Lo s s v s . Bp -p
10
5 0 0 kHz
4 0 0 kHz
1
3 0 0 kHz
2 0 0 kHz
1 0 0 kHz
C o re L o ss (W )
0 .1
0 .0 1
0 .0 0 1
0 .0 0 0 1
0 .0 0 0 0 1
100
1000
10000
Bp -p (G a u s s )
inductance Characteristics
% of O C L v s I
s a t
110%
100%
90%
80%
-4 0 °C
% of OC L
70%
+2 5 °C
60%
+8 5 °C
50%
40%
30%
20%
10%
100%
120%
140%
160%
180%
20%
40%
60%
80%
0%
0%
% o f I
s at
0609
BU09493
Page 3 of 4
Data Sheet: 4369
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Volume
Package
mm
3
Thickness
<350
<1.6mm
260°C
1.6 – 2.5mm 260°C
>2.5mm
250°C
Time
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020D
Profile Feature
Preheat
and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free
Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
Table 2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
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