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LOC B
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114-1049
2.3. Drawings
Customer Drawings for product part numbers are available from the service network. If there is a conflict
between the information contained in the Customer Drawings and this specification or with any other technical
documentation supplied, the information contained in the Customer Drawings takes priority.
2.4. Specifications
Product Specification 108-1066 provides product performance and test information.
2.5. Instructional Material
Instruction Sheets (408-series) provide product assembly instructions or tooling setup and operation procedures
and Customer Manuals (409-series) provide machine setup and operating procedures. There are no documents
available that pertain to this product.
2.6. Manuals
Manual 402-40 can be used as a guide to soldering. This manual provides information on various flux types and
characteristics with the commercial designation and flux removal procedures. A checklist is included in the
manual as a guide for information on soldering problems.
3. REQUIREMENTS
3.1. Storage
A. Ultraviolet Light
Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the socket material.
B. Shelf Life
The sockets should remain in the shipping containers until ready for use to prevent deformation to the
contacts. The sockets should be used on a first in, first out basis to avoid storage contamination that could
adversely affect performance.
3.2. PC Board
A. Thickness
The recommended maximum pc board thickness is 2.36 [.093].
B. Layout
The pc board layout must be designed using the dimensions given in Figure 2.
3.3. Soldering
A. Process
Manual 402-40 provides guidelines for soldering process.
B. Flux Selection
Contact solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the
flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux
must be compatible with the wave solder line, manufacturing, health, and safety requirements.
C. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents.
D. Drying
When drying cleaned assemblies and pc boards, the temperature limitation must not be exceeded: 105°C
[221°F] and 85°C [185°F] for copper alloy contact material. Excessive temperatures may cause housing
degradation and/or plating deterioration.
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A
25.4 [.100] Typ
0.914±0.076[.036±.003]
Dia Typ
0.228 [.009] M
B±0.102 [.004]
A (Ref)
B±0.102 [.004]
SOCKET NUMBER OF POSITIONS
6-20
22
24-48
64
CENTERLINE SPACING DIMENSION
A
076.2
[.300]
10.16 [.400]
15.24 [.600]
22.85 [.900]
Figure 2
B
3.81 [.150]
5.08 [.200]
7.62 [.300]
—
3.4. Seating the Socket
To hold the socket in place during handling and soldering, solder tail clinching may be desired. Method of
clinching is at the discretion of the application.
NOTE
Sockets with a retention leg do not need clinching to hold them in place.
i
Excessive force to the ends of the solder tails (perpendicular to the pc board) must be avoided; otherwise the
contacts could become dislodged from their position in the housing.
3.5. Checking Installed Socket
The socket must be parallel to the pc board and the housing must be bottomed on the pc board. Solder fillets
must be evenly formed around each contact solder tine. There must be no cracks in the solder.
4. QUALIFICATION
DIPLOMATE DL low-profile DIP sockets are Recognized by Underwriters Laboratories Inc. (UL) and Certified by
CSA International.
5. TOOLING
These sockets can be applied to the pc board manually or by automatic machine. For recommended machines,
call TOOLING ASSISTANCE CENTER at the number at the bottom of page 1.
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6. VISUAL AID
The illustration below shows a typical application of this product. This illustration should be used by production
personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected
using the information in the preceding pages of this specification and in the instructional material shipped with
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FPGA/CPLD
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