AM29F800BT-55WBD datasheet, PDF

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AM29F800BT-55WBD: DescriptionFlash, 512KX16, 55ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48; Categorystorage storage; File Size1MB，45 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM29F800BT-55WBD Overview

Flash, 512KX16, 55ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48

AM29F800BT-55WBD Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	6 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
Contacts	48
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	55 ns
Other features	TOP BOOT BLOCK
Spare memory width	8
startup block	TOP
command user interface	YES
Data polling	YES
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	9 mm
memory density	8388608 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	1,2,1,15
Number of terminals	48
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	16K,8K,32K,64K
Maximum standby current	0.001 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	6 mm

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Am29F800B

Data Sheet

(Retired Product)

Am29F800B Cover Sheet

This product has been retired and is not recommended for designs. Please contact your Spansion representative for

alternates. Availability of this document is retained for reference and historical purposes only.

The following document contains information on Spansion memory products.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been

made are the result of normal data sheet improvement and are noted in the document revision summary.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

21504

Revision

Amendment

Issue Date

March 3, 2009

DATA SHEET

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5

Special Handling Instructions for FBGA Package .................... 6

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9

Table 1. Am29F800B Device Bus Operations ..................................9

DQ3: Sector Erase Timer ....................................................... 21

Figure 5. Toggle Bit Algorithm........................................................ 21

Table 6. Write Operation Status ..................................................... 22

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 23

Figure 6. Maximum Negative Overshoot Waveform ...................... 23

Figure 7. Maximum Positive Overshoot Waveform........................ 23

Word/Byte Configuration .......................................................... 9

Requirements for Reading Array Data ..................................... 9

Writing Commands/Command Sequences .............................. 9

Program and Erase Operation Status .................................... 10

Standby Mode ........................................................................ 10

RESET#: Hardware Reset Pin ............................................... 10

Output Disable Mode .............................................................. 10

Table 2. Am29F800BT Top Boot Block Sector Address Table .......11

Table 3. Am29F800BB Bottom Boot Block Sector Address Table ..12

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24

TTL/NMOS Compatible .......................................................... 24

CMOS Compatible .................................................................. 25

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Figure 8. Test Setup....................................................................... 26

Table 7. Test Specifications ........................................................... 26

Key to Switching Waveforms. . . . . . . . . . . . . . . . 26

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27

Read Operations .................................................................... 27

Figure 9. Read Operations Timings ............................................... 27

Hardware Reset (RESET#) .................................................... 28

Figure 10. RESET# Timings .......................................................... 28

Autoselect Mode ..................................................................... 12

Table 4. Am29F800B Autoselect Codes (High Voltage Method) ....13

Word/Byte Configuration (BYTE#) ........................................ 29

Figure 11. BYTE# Timings for Read Operations............................ 29

Figure 12. BYTE# Timings for Write Operations............................ 29

Sector Protection/Unprotection ............................................... 13

Temporary Sector Unprotect .................................................. 13

Figure 1. Temporary Sector Unprotect Operation........................... 13

Erase/Program Operations ..................................................... 30

Figure 13. Program Operation Timings..........................................

Figure 14. Chip/Sector Erase Operation Timings ..........................

Figure 15. Data# Polling Timings (During Embedded Algorithms).

Figure 16. Toggle Bit Timings (During Embedded Algorithms)......

Figure 17. DQ2 vs. DQ6.................................................................

Hardware Data Protection ...................................................... 14

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 14

Reading Array Data ................................................................ 14

Reset Command ..................................................................... 14

Autoselect Command Sequence ............................................ 15

Word/Byte Program Command Sequence ............................. 15

Figure 2. Program Operation .......................................................... 15

Temporary Sector Unprotect .................................................. 34

Figure 18. Temporary Sector Unprotect Timing Diagram .............. 34

Figure 19. Alternate CE# Controlled Write Operation Timings ...... 36

Chip Erase Command Sequence ........................................... 15

Sector Erase Command Sequence ........................................ 16

Erase Suspend/Erase Resume Commands ........................... 16

Figure 3. Erase Operation............................................................... 17

Command Definitions ............................................................. 18

Table 5. Am29F800B Command Definitions ...................................18

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 19

DQ7: Data# Polling ................................................................. 19

Figure 4. Data# Polling Algorithm ................................................... 19

RY/BY#: Ready/Busy# ........................................................... 20

DQ6: Toggle Bit I .................................................................... 20

DQ2: Toggle Bit II ................................................................... 20

Reading Toggle Bits DQ6/DQ2 .............................................. 20

DQ5: Exceeded Timing Limits ................................................ 21

Erase and Programming Performance . . . . . . . 37

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 37

TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 37

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 38

SO 044—44-Pin Small Outline Package ................................ 38

TS 048—48-Pin Standard Pinout Thin Small

Outline Package (TSOP) ........................................................ 39

FBB048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 6 x 9 mm

package .................................................................................. 40

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 41

March 3, 2009 21504E6

Am29F800B

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