BU3058FV-E2 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> BU3058FV-E2

BU3058FV-E2: DescriptionClock Generator, PDSO16,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size131KB，5 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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BU3058FV-E2 Overview

Clock Generator, PDSO16,

BU3058FV-E2 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
package instruction	TSSOP, TSSOP16,.25
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-30 code	R-PDSO-G16
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature	-10 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply	3.3 V
Certification status	Not Qualified
Maximum slew rate	52 mA
Nominal supply voltage	3.3 V
surface mount	YES
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	DUAL

BU3058FV-E2 Preview

1/4

Structure

Product

Type

Feature

Silicon monolithic Integrated circuit

Clock Generator With Built-in VCXO

BU3058FV

To generate clocks for the Digital-TV.

Clock signals are generated by connecting crystal oscillator.

Built-in VCXO has the variable width of Typ±105ppm.

○Absolute

Maximum Ratings

(Ta=25℃)

Parameter

Symbol

Ratings

Unit

-0.3

½4.0

Supply voltage

VDD

-0.3½VDD+0.3

Input Voltage

VIN

-55½125

℃

Storage Temperature range

Tstg

※

450

Power dissipation

※

A measure value at mounting on 70x70x1.6mm glass epoxy substrate.

In the case of exceeding Ta=25°C, 4.5mW should be reduced per 1°C.

※

The radiation-resistance design is not carried out.

※

Operation is not guaranteed.

○Operating

Conditions

Parameter

Supply voltage

Input ”H” Voltage

Input ”L” Voltage

Operating

Temperature

Frequency

Control Voltage

Symbol

VDD

VIH

VIL

topr

Ratings

3.135

3.465

0.8VDD

VDD

0.0

0.2VDD

-10

0.0

VDD

Unit

℃

REV. A

2/4

○

Electrical Characteristics

（

VDD=3.3V, Ta=25°C, Crystal Frequency=27.000000MHz, at No Load, unless otherwise specified

）

Parameter

Symbol

VOH

VOL

IDD

IupH

IdnH

IdirH

IupL

IdnL

IdirL

※

Limit

Min.

VDD-0.4

－

-1.5

19.0

-1.5

-126.0

-1.5

±80

Typ.

－

40.0

－

69.0

－

-53.0

－

±105

Max.

－

0.4

52.0

1.5

136.5

1.5

-17.0

1.5

±130

Unit

μA

ppm

IOH=4.0mA

IOL=4.0mA

Conditions

Output H voltage

Output L voltage

Operating

circuit current

Input H current

Input L current

Crystal Pullability

Output No Load

PDB Terminal,VIH=VDD

TEST Terminal,VIH=VDD

VCTRL, SEL1, SEL2 Terminal,VIH=VDD

PDB Terminal,VIL=0.0V

TEST Terminal,VIL=0.0V

VCTRL, SEL1, SEL2 Terminal,VIL=0.0V

0≦VCTRL≦VDD

※

This is a guarantee with only IC.

The arrangement with a crystal maker is required separately about crystal variation.

○Block

diagram

7:SEL1

8:SEL2

Output

Select

Control

PLL1

11:CLK54M

10:TEST

TEST Terminal,With pull-down

15:PDB

Power-down control terminal

With pull-up

PLL2

14:CLKOUT

4:VCTRL

1:XIN

VCXO

16:XOUT

9:CLK27M

○Table

of Output Frequency（Crystal Frequency=27.000000MHz）

mode No.

①

②

③

④

SEL1

SEL2

14pin

CLKOUT

66.000000MHz

74.250000MHz

77.000000MHz

82.000000MHz

11pin

CLK54M

54.000000MHz

9pin

CLK27M

27.000000MHz

REV. A

3/4

○Package

Outline, Appearance of Marker

3058F

Lot No.

SSOP-B16

○Pin

Function

PIN No.

PIN Name

XIN

AVDD1

AVSS1

VCTRL

AVDD2

AVSS2

SEL1

SEL2

CLK27M

TEST

CLK54M

VSS

VDD

CLKOUT

PDB

XOUT

Function

Crystal Input terminal

Power supply for VCXO

GND for VCXO

VCXO control input terminal

Power supply for PLL-Analog

GND for PLL-Analog

CLKOUT output control terminal1

CLKOUT output control terminal2

27.000000MHz Output

Test terminal with pull-down

54.000000MHz Output

GND for PLL-Digital

Power supply for PLL-Digital

66.000000MHz / 74.250000MHz / 77.000000MHz / 82.000000MHz Output

Power-down control terminal,with pull-up

Crystal Output terminal

●Cautions

on use（BU3058FV）

Basically, mount ICs to the printed circuit board for use. (If the ICs are not mounted to the printed circuit board,

the characteristics of ICs may not be fully demonstrated.)

Mount 0.1µF capacitors in the vicinity of the IC PINs between 2PIN (AVDD1), 3PIN (AVSS1), and 5PIN(AVDD2),

6PIN(AVSS2), and 12PIN (VSS), 13PIN (VDD) respectively.

To obtain accurate frequency, capacitance (pF) need to be placed between 3PIN (AVSS1) and 1PIN (XIN),

3PIN (AVSS1) and 16PIN(XOUT).

Depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the

power supply and GND terminal.

For EMI protection, it is effective to put ferrite beads in the origin of power supply to be fed to BU3058FV from the

printed circuit board or to insert a capacitor (of 1 or less), which bypasses high frequency desired, between the

power supply and the GND terminal.

For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the

internal powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power

wiring, width of GND wiring, and routing of wiring.

REV. A

4/4

●

Cautions on use

（common）

（１）Absolute

Maximum Ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down

devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the

absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc.

（２）Operating

conditions

These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics

are guaranteed under the conditions of each parameter.

（３）Reverse

connection of power supply connector

The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the

reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.

（４）Power

supply line

Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.In this regard, for the digital block

power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power

supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power

supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar

manner.

Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in

order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem

including the occurrence of capacity dropout at a low temperature, thus determining the constant.

（５）GND

voltage

Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to

be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.

（６）Short

circuit between terminals and erroneous mounting

In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the

ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply

or the GND terminal, the ICs can break down.

（７）Operation

in strong electromagnetic field

Be noted that using ICs in the strong electromagnetic field can malfunction them.

（８）Inspection

with set PCB

On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure

to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection

process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn

OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the

assembly process and pay thorough attention to the transportation and the storage of the set PCB.

（９）Input

terminals

In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can

cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough

attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any

parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC.

In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within

the guaranteed value of electrical characteristics.

（１０）Ground

wiring pattern

If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the

small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and

voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause

fluctuations in the GND wiring pattern of external parts as well.

（１１）External

capacitor

In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation

in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.

REV. A

Notice

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content specified herein is subject to change for improvement without notice.

The content specified herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the specifications,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specified in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information specified herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products specified in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, office-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products specified in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, fire or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,

fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of

any of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specified herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R0039A

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