SPST, 1 Func, 8 Channel, CMOS, PQCC28, PLASTIC, LCC-28
| Parameter Name | Attribute value |
| Maker | Universal Semiconductor Inc |
| Parts packaging code | QLCC |
| package instruction | , |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | S-PQCC-J28 |
| Number of channels | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| Nominal off-state isolation | 45 dB |
| On-state resistance matching specifications | 9 Ω |
| Maximum on-state resistance (Ron) | 45 Ω |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | YES |
| Maximum disconnect time | 5000 ns |
| Maximum connection time | 5000 ns |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | J BEND |
| Terminal location | QUAD |
| USH5010-AIK28 | USH5010-AIP24 | USH5010-AIL28 | USH5010-AIC24 | |
|---|---|---|---|---|
| Description | SPST, 1 Func, 8 Channel, CMOS, PQCC28, PLASTIC, LCC-28 | SPST, 1 Func, 8 Channel, CMOS, PDIP24, PLASTIC, DIP-24 | SPST, 1 Func, 8 Channel, CMOS, CQCC28, CERAMIC, LCC-28 | SPST, 1 Func, 8 Channel, CMOS, CDIP24, SIDE BRAZED, CERAMIC, DIP-24 |
| Parts packaging code | QLCC | DIP | QLCC | DIP |
| Contacts | 28 | 24 | 28 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST |
| JESD-30 code | S-PQCC-J28 | R-PDIP-T24 | S-CQCC-N28 | R-CDIP-T24 |
| Number of channels | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 24 | 28 | 24 |
| Nominal off-state isolation | 45 dB | 45 dB | 45 dB | 45 dB |
| On-state resistance matching specifications | 9 Ω | 9 Ω | 9 Ω | 9 Ω |
| Maximum on-state resistance (Ron) | 45 Ω | 45 Ω | 45 Ω | 45 Ω |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V |
| surface mount | YES | NO | YES | NO |
| Maximum disconnect time | 5000 ns | 5000 ns | 5000 ns | 5000 ns |
| Maximum connection time | 5000 ns | 5000 ns | 5000 ns | 5000 ns |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | J BEND | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal location | QUAD | DUAL | QUAD | DUAL |