Serial IO/Communication Controller, CMOS, CQCC84,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Aeroflex |
| package instruction | QCCN, LCC84,1.2SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-XQCC-N84 |
| JESD-609 code | e0 |
| Number of terminals | 84 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC84,1.2SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum slew rate | 50 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |





| UT1553BBCRTMA | UT1553BBCRTMG | UT1553BBCRTMW | UT1553BCRTMA | UT1553BCRTMG | UT1553BCRTMW | |
|---|---|---|---|---|---|---|
| Description | Serial IO/Communication Controller, CMOS, CQCC84, | Serial IO/Communication Controller, CMOS, CPGA84, | Serial IO/Communication Controller, CMOS, CQFP84, | Serial IO/Communication Controller, CMOS, CQCC84, | Serial IO/Communication Controller, CMOS, CPGA84, | Serial IO/Communication Controller, CMOS, CQFP84, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex |
| package instruction | QCCN, LCC84,1.2SQ | PGA, PGA84M,11X11 | QFF, QFL84,1.2SQ | QCCJ, LDCC84,1.2SQ | PGA, PGA84M,11X11 | QFF, QFL84,1.2SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-XQCC-N84 | S-XPGA-P84 | S-XQFP-F84 | S-XQCC-J84 | S-XPGA-P84 | S-XQFP-F84 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 84 | 84 | 84 | 84 | 84 | 84 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QCCN | PGA | QFF | QCCJ | PGA | QFF |
| Encapsulate equivalent code | LCC84,1.2SQ | PGA84M,11X11 | QFL84,1.2SQ | LDCC84,1.2SQ | PGA84M,11X11 | QFL84,1.2SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | GRID ARRAY | FLATPACK | CHIP CARRIER | GRID ARRAY | FLATPACK |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum slew rate | 50 mA | 50 mA | 50 mA | 50 mA | 50 mA | 50 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | PIN/PEG | FLAT | J BEND | PIN/PEG | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | PERPENDICULAR | QUAD | QUAD | PERPENDICULAR | QUAD |