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UT1553BBCRTMW

Description
Serial IO/Communication Controller, CMOS, CQFP84,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size3MB,51 Pages
ManufacturerAeroflex
Websitehttp://www.aeroflex.com/
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UT1553BBCRTMW Overview

Serial IO/Communication Controller, CMOS, CQFP84,

UT1553BBCRTMW Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAeroflex
package instructionQFF, QFL84,1.2SQ
Reach Compliance Codeunknown
JESD-30 codeS-XQFP-F84
JESD-609 codee0
Number of terminals84
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeQFF
Encapsulate equivalent codeQFL84,1.2SQ
Package shapeSQUARE
Package formFLATPACK
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum slew rate50 mA
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationQUAD

UT1553BBCRTMW Related Products

UT1553BBCRTMW UT1553BBCRTMA UT1553BBCRTMG UT1553BCRTMA UT1553BCRTMG UT1553BCRTMW
Description Serial IO/Communication Controller, CMOS, CQFP84, Serial IO/Communication Controller, CMOS, CQCC84, Serial IO/Communication Controller, CMOS, CPGA84, Serial IO/Communication Controller, CMOS, CQCC84, Serial IO/Communication Controller, CMOS, CPGA84, Serial IO/Communication Controller, CMOS, CQFP84,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Aeroflex Aeroflex Aeroflex Aeroflex Aeroflex Aeroflex
package instruction QFF, QFL84,1.2SQ QCCN, LCC84,1.2SQ PGA, PGA84M,11X11 QCCJ, LDCC84,1.2SQ PGA, PGA84M,11X11 QFF, QFL84,1.2SQ
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code S-XQFP-F84 S-XQCC-N84 S-XPGA-P84 S-XQCC-J84 S-XPGA-P84 S-XQFP-F84
JESD-609 code e0 e0 e0 e0 e0 e0
Number of terminals 84 84 84 84 84 84
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code QFF QCCN PGA QCCJ PGA QFF
Encapsulate equivalent code QFL84,1.2SQ LCC84,1.2SQ PGA84M,11X11 LDCC84,1.2SQ PGA84M,11X11 QFL84,1.2SQ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK CHIP CARRIER GRID ARRAY CHIP CARRIER GRID ARRAY FLATPACK
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Maximum slew rate 50 mA 50 mA 50 mA 50 mA 50 mA 50 mA
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT NO LEAD PIN/PEG J BEND PIN/PEG FLAT
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location QUAD QUAD PERPENDICULAR QUAD PERPENDICULAR QUAD
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