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LM3S6918-IBZ50-A2T

Description
ARM Microcontrollers - MCU IC ARM CORTEX MCU
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size5MB,694 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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LM3S6918-IBZ50-A2T Overview

ARM Microcontrollers - MCU IC ARM CORTEX MCU

LM3S6918-IBZ50-A2T Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Contains lead
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionLFBGA, BGA108,12X12,32
Contacts108
Reach Compliance Codecompli
Has ADCYES
Address bus width
bit size32
maximum clock frequency0.032 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeS-PBGA-B108
JESD-609 codee1
length10 mm
Humidity sensitivity level3
Number of I/O lines38
Number of terminals108
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA108,12X12,32
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply2.5,3.3 V
Certification statusNot Qualified
RAM (bytes)65536
rom(word)262144
ROM programmabilityFLASH
Maximum seat height1.5 mm
speed50 MHz
Maximum supply voltage2.75 V
Minimum supply voltage2.25 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width10 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC

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Description ARM Microcontrollers - MCU IC ARM CORTEX MCU Stellaris LM3S Microcontroller 100-LQFP -40 to 85 Stellaris LM3S Microcontroller 108-NFBGA -40 to 85 Stellaris LM3S Microcontroller 100-LQFP -40 to 105 Stellaris LM3S Microcontroller 100-LQFP -40 to 105 Stellaris LM3S Microcontroller 100-LQFP -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA QFP BGA QFP QFP QFP
package instruction LFBGA, BGA108,12X12,32 LFQFP, QFP100,.63SQ,20 LFBGA, BGA108,12X12,32 LFQFP, QFP100,.63SQ,20 LQFP-100 LQFP-100
Contacts 108 100 108 100 100 100
Reach Compliance Code compli compli compli compliant compliant compliant
Has ADC YES YES YES YES YES YES
bit size 32 32 32 32 32 32
maximum clock frequency 0.032 MHz 8 MHz 0.032 MHz 0.032 MHz 0.032 MHz 0.032 MHz
DAC channel NO NO NO NO NO NO
DMA channel NO NO NO NO NO NO
JESD-30 code S-PBGA-B108 S-PQFP-G100 S-PBGA-B108 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100
JESD-609 code e1 e3 e1 e3 e3 e3
length 10 mm 14 mm 10 mm 14 mm 14 mm 14 mm
Humidity sensitivity level 3 3 3 3 3 3
Number of I/O lines 38 62 38 38 38 38
Number of terminals 108 100 108 100 100 100
Maximum operating temperature 85 °C 85 °C 85 °C 105 °C 105 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFQFP LFBGA LFQFP LFQFP LFQFP
Encapsulate equivalent code BGA108,12X12,32 QFP100,.63SQ,20 BGA108,12X12,32 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY FLATPACK GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
power supply 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 65536 65536 65536 65536 65536 65536
rom(word) 262144 262144 262144 262144 262144 262144
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH
Maximum seat height 1.5 mm 1.6 mm 1.5 mm 1.6 mm 1.6 mm 1.6 mm
speed 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Maximum supply voltage 2.75 V 3.6 V 2.75 V 2.75 V 2.75 V 2.75 V
Minimum supply voltage 2.25 V 3 V 2.25 V 2.25 V 2.25 V 2.25 V
Nominal supply voltage 2.5 V 3.3 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) TIN Matte Tin (Sn)
Terminal form BALL GULL WING BALL GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.5 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM QUAD BOTTOM QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10 mm 14 mm 10 mm 14 mm 14 mm 14 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Is it lead-free? Contains lead Lead free Lead free Lead free - Lead free
Factory Lead Time - 8 weeks 1 week 1 week 19 weeks 6 weeks
boundary scan - YES YES YES - YES
CPU series - CORTEX-M3 CORTEX-M3 CORTEX-M3 - CORTEX-M3
Format - FIXED POINT FIXED POINT FIXED POINT - FIXED POINT
Integrated cache - YES YES YES - YES
low power mode - YES YES YES - YES
Number of serial I/Os - 7 7 7 - 7
Number of timers - 4 4 4 - 4
On-chip data RAM width - 8 8 8 - 8
On-chip program ROM width - 8 8 8 - 8
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