LTC2861 - 20Mbps RS485 Transceivers with Integrated Switchable Termination; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C
LTC2861IGN#TR Parametric
Parameter Name
Attribute value
Brand Name
Linear Technology
Is it Rohs certified?
incompatible
Maker
Linear ( ADI )
Parts packaging code
SSOP
package instruction
SSOP, SSOP16,.25
Contacts
16
Manufacturer packaging code
GN
Reach Compliance Code
not_compliant
ECCN code
EAR99
Differential output
YES
Number of drives
1
Input properties
DIFFERENTIAL SCHMITT TRIGGER
Interface integrated circuit type
LINE TRANSCEIVER
Interface standards
EIA-485-A; TIA-485-A
JESD-30 code
R-PDSO-G16
JESD-609 code
e0
length
4.8895 mm
Humidity sensitivity level
1
Number of functions
1
Number of terminals
16
Maximum operating temperature
85 °C
Minimum operating temperature
-40 °C
Minimum output swing
1.5 V
Package body material
PLASTIC/EPOXY
encapsulated code
SSOP
Encapsulate equivalent code
SSOP16,.25
Package shape
RECTANGULAR
Package form
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)
235
power supply
5 V
Certification status
Not Qualified
Maximum receive delay
70 ns
Number of receiver bits
1
Maximum seat height
1.75 mm
Maximum supply voltage
5.5 V
Minimum supply voltage
4.5 V
Nominal supply voltage
5 V
surface mount
YES
technology
CMOS
Temperature level
INDUSTRIAL
Terminal surface
Tin/Lead (Sn/Pb)
Terminal form
GULL WING
Terminal pitch
0.635 mm
Terminal location
DUAL
Maximum time at peak reflow temperature
20
maximum transmission delay
50 ns
width
3.899 mm
LTC2861IGN#TR Preview
FeaTures
n
n
n
n
LTC2859/LTC2861
20Mbps RS485 Transceivers
with Integrated Switchable
Termination
DescripTion
The LTC
®
2859 and LTC2861 are low power, 20Mbps
RS485/422 transceivers operating on 5V supplies. The
receiver includes a logic-selectable 120Ω termination,
one-eighth unit load supporting up to 256 nodes per bus
(C-, I-grades), and a failsafe feature that guarantees a high
output state under conditions of floating or shorted inputs.
The driver features a logic-selectable low-EMI 250kbps
operating mode, and maintains a high output impedance
over the entire common mode range when disabled or
when the supply is removed. Excessive power dissipation
caused by bus contention or a fault is prevented by current
limiting all outputs and by a thermal shutdown.
Enhanced ESD protection allows the LTC2859 and LTC2861
to withstand ±15kV (human body model) on the transceiver
interface pins without latchup or damage.
n
n
n
n
n
n
n
n
n
Integrated, Logic-Selectable 120Ω Termination
Resistor
20Mbps Max Data Rate
No Damage or Latchup to ESD: ±15kV HBM
High Input Impedance Supports 256 Nodes
(C-, I-Grades)
Operation Up to 105°C (LTC2859H)
250kbps Low-EMI Mode
Guaranteed Failsafe Receiver Operation Over the
Entire Common Mode Range
Current Limited Drivers and Thermal Shutdown
Delayed Micropower Shutdown (5µA Max)
Power Up/Down Glitch-Free Driver Outputs
Low Operating Current (900µA Max in Receive Mode)
Meets All TIA/EIA-485-A Specifications
Available in 10-Pin 3mm
×
3mm DFN, 12-Pin
4mm
×
3mm DFN and 16-Pin SSOP Packages
applicaTions
n
n
n
proDucT selecTion GuiDe
PART NUMBER
LTC2859
LTC2861
DUPLEX
Half
Full
PACKAGE
DFN-10
SSOP-16, DFN-12
Low Power RS485/RS422 Transceiver
Level Translator
Backplane Transceiver
L,
LT, LTC, LTM, Linear Technology, the Linear logo and µModule are registered trademarks of
Linear Technology Corporation. All other trademarks are the property of their respective owners.
Typical applicaTion
LTC2859
RO
RE
TE
DE
DI
SLO
D
LTC2859
2859/61 TA01
LTC2859
R
RO
RE
TE
DE
D
DI
SLO
R
LTC2859 at 20Mbps
DI
Y
Z
Y–Z
120Ω
120Ω
120Ω
2V/DIV
R
D
20ns/DIV
285961 TA02
RO
RE
TE DE
DI
SLO
285961fc
1
LTC2859/LTC2861
absoluTe maximum raTinGs
(Note 1)
Supply Voltage (V
CC
) ................................... –0.3V to 7V
Logic Input Voltages (RE, DE, DI, TE,
SLO)
.... –0.3V to 7V
Interface I/O:
A, B, Y, Z .......................................(V
CC
–15V) to +15V
(A-B) or (B-A) with Terminator Enabled ..................6V
Receiver Output Voltage (RO) ........–0.3V to (V
CC
+0.3V)
Operating Temperature (Note 4)
LTC2859C, LTC2861C .............................. 0°C to 70°C
LTC2859I, LTC2861I ............................–40°C to 85°C
LTC2859H .......................................... –40°C to 105°C
Storage Temperature Range .................. –65°C to 125°C
Lead Temperature (Soldering, 10 sec)
GN Package ...................................................... 300°C
pin conFiGuraTion
TOP VIEW
TOP VIEW
RO
RE
DE
DI
TE
1
2
3
4
5
11
10 V
CC
9 B
8 A
7
SLO
6 GND
RO
RE
DE
DI
TE
GND
DD PACKAGE
10-LEAD (3mm
×
3mm) PLASTIC DFN
EXPOSED PAD (PIN 11) PCB GND CONNECTION
T
JMAX
= 125°C,
θ
JA
= 43°C/W
θ
JC
= 3°C/W
1
2
3
4
5
6
13
12 V
CC
11 A
10 B
9
8
7
Z
Y
SLO
RO
RE
DE
DI
TE
GND
NC
NC
1
2
3
4
5
6
7
8
TOP VIEW
16 V
CC
15 A
14 B
13 Z
12 Y
11
SLO
10 NC
9
NC
DE PACKAGE
12-LEAD (4mm
×
3mm) PLASTIC DFN
EXPOSED PAD (PIN 13) PCB GND CONNECTION
T
JMAX
= 125°C,
θ
JA
= 43°C/W
θ
JC
= 4.3°C/W
GN PACKAGE
16-LEAD (NARROW 0.150) PLASTIC SSOP
T
JMAX
= 125°C,
θ
JA
= 110°C/W
θ
JC
= 40°C/W
orDer inFormaTion
LEAD FREE FINISH
LTC2861CDE#PBF
LTC2861IDE#PBF
LTC2861CGN#PBF
LTC2861IGN#PBF
LTC2859CDD#PBF
LTC2859IDD#PBF
LTC2859HDD#PBF
TAPE AND REEL
LTC2861CDE#TRPBF
LTC2861IDE#TRPBF
LTC2861CGN#TRPBF
LTC2861IGN#TRPBF
LTC2859CDD#TRPBF
LTC2859IDD#TRPBF
LTC2859HDD#TRPBF
PART MARKING*
2861
2861
2861
2861I
LBNX
LBNX
LBNX
PACKAGE DESCRIPTION
12-Lead (4mm
×
3mm) Plastic DFN
12-Lead (4mm
×
3mm) Plastic DFN
16-Lead Plastic SSOP
16-Lead Plastic SSOP
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead (3mm
×
3mm) Plastic DFN
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
–40°C to 105°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
285961fc
2
LTC2859/LTC2861
elecTrical characTerisTics
SYMBOL
Driver
|V
OD
|
D|V
OD
|
V
OC
D|V
OC
|
I
OZD
I
OSD
Receiver
I
IN2
Receiver Input Current (A, B)
DE = TE = 0V, V
CC
= 0V or 5V, V
A
or V
B
= 12V,
Other at 0V
(H-Grade)
DE = TE = 0V, V
CC
= 0V or 5V, V
A
or V
B
= –7V,
Other at 0V
(H-Grade)
V
TH
DV
TH
V
OH
V
OL
I
OZR
R
IN
Receiver Differential Input Threshold
Voltage
Receiver Input Hysteresis
Receiver Output HIGH Voltage
Receiver Output LOW Voltage
Receiver Three-State (High
Impedance) Output Current on RO
Receiver Input Resistance
–7V ≤ V
CM
≤ 12
V
CM
= 0V
I
0
= –4mA, V
ID
= 200mV, V
CC
= 4.5V
I
0
= 4mA, V
ID
= –200mV, V
CC
= 4.5V
RE
= 5V, 0V ≤ V
O
≤ V
CC
RE
= 5V or 0V, DE = TE = 0V
–7V ≤ V
A
= V
B
≤ 12V
(H-Grade)
R
TERM
Logic
V
IH
V
IL
I
IN1
Supplies
I
SHDN
I
CCR
I
CCT
I
CCTS
I
CCL
I
CCRT
Supply Current in Shutdown Mode
Supply Current in Receive Mode
Supply Current in Transmit Mode
Supply Current in Transmit SLO Mode
Supply Current in Loopback Mode
(Both Driver and Receiver Enabled)
Supply Current in Termination Mode
DE = 0V,
RE
= V
CC
, TE = 0V
No Load, DE = 0V,
RE
= 0V, TE = 0V
No Load, DE = V
CC
,
RE
= V
CC
,
SLO
= V
CC
, TE = 0V
No Load, DE = V
CC
,
RE
= V
CC
,
SLO
= 0V, TE = 0V
No Load, DE = V
CC
,
RE=
0V,
SLO
= V
CC
, TE = 0V
DE = 0V,
RE
= V
CC
, TE = V
CC
,
SLO
= V
CC
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C, V
CC
= 5V unless otherwise noted (Note 2).
PARAMETER
Differential Driver Output Voltage
CONDITIONS
R = ∞, I
O
= 0mA, V
CC
= 4.5V (Figure 1)
R = 27Ω (RS485), V
CC
= 4.5V (Figure 1)
R = 50Ω (RS422), V
CC
= 4.5V (Figure 1)
R = 27Ω or R = 50Ω (Figure 1)
l
l
l
l
MIN
TYP
MAX
V
CC
V
CC
V
CC
0.2
UNITS
V
V
V
V
1.5
2.0
Change in Magnitude of Driver
Differential Output Voltage for
Complementary Output States
Driver Common Mode Output Voltage
Change in Magnitude of Driver
Common Mode Output Voltage for
Complementary Output States
Driver Three-State (High Impedance)
Output Current on Y and Z
R = 27Ω or R = 50Ω (Figure 1)
R = 27Ω or R = 50Ω (Figure 1)
l
l
3.0
0.2
V
V
DE = OV, V
O
= –7V, +12V
(LTC2861 Only)
l
l
±10
±120
±250
125
250
–100
–145
±0.2
25
2.4
0.4
±1
96
48
108
125
125
120
156
µA
mA
µA
µA
µA
µA
V
mV
V
V
µA
kΩ
kΩ
Ω
Maximum Driver Short-Circuit Current –7V ≤ (Y or Z) ≤ 12 (Figure 2)
Receiver Input Terminating Resistor
TE = 5V, V
AB
= 2V, V
B
= –7, 0, 10V
(Figure 7)
DE, DI,
RE,
TE,
SLO,
V
CC
= 4.5V
DE, DI,
RE,
TE,
SLO,
V
CC
= 4.5V
DE, DI,
RE,
TE,
SLO
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
l
l
l
2
0.8
0
0
540
630
670
660
640
±10
5
900
1000
1100
1100
1180
V
V
µA
µA
µA
µA
µA
µA
µA
285961fc
3
LTC2859/LTC2861
swiTchinG characTerisTics
SYMBOL
f
MAX
t
PLHD
, t
PHLD
Dt
PD
t
SKEWD
t
RD
, t
FD
PARAMETER
Maximum Data Rate
Driver Input to Output
Driver Input to Output Difference
|t
PLHD
-t
PHLD
|
Driver Output Y to Output Z
Driver Rise or Fall Time
Driver in Normal Mode (SLO HIGH)
Note 3
R
DIFF
= 54Ω, C
L
= 100pF (Figure 3)
R
DIFF
= 54Ω, C
L
= 100pF (Figure 3)
R
DIFF
= 54Ω, C
L
= 100pF (Figure 3)
R
DIFF
= 54Ω, C
L
= 100pF (Figure 3)
R
L
= 500Ω, C
L
= 50pF,
RE
= 0 (Figure 4)
R
L
= 500Ω, C
L
= 50pF,
RE
= V
CC
(Figure 4)
(DE =
↓,
RE
= V
CC
) or (DE = 0,
RE
↑)
(Figure 4)
Note 3
R
DIFF
= 54Ω, C
L
= 100pF (Figure 3)
R
DIFF
= 54Ω, C
L
= 100pF (Figure 3)
R
DIFF
= 54Ω, C
L
= 100pF (Figure 3)
(H-Grade)
R
DIFF
= 54Ω, C
L
= 100pF (Figure 3)
R
L
= 500Ω, C
L
= 50pF,
RE
= 0 (Figure 4)
R
L
= 500Ω, C
L
= 50pF,
RE
= 0 (Figure 4)
R
L
= 500Ω, C
L
= 50pF,
RE
= V
CC
(Figure 4)
(DE = 0,
RE
=
↑)
or (DE =
↓,
RE
= V
CC
) (Figure 4)
C
L
= 15pF, V
CM
= 1.5V, |V
AB
| = 1.5V, t
R
and t
F
<
4ns (Figure 5)
C
L
= 15pF (Figure 5)
C
L
= 15pF (Figure 5)
R
L
= 1kΩ, C
L
=15pF, DE = V
CC
(Figure 6)
DI = 0 or V
CC
R
L
= 1kΩ, C
L
= 15pF, DE = 0V (Figure 6)
DI = 0 or V
CC
V
B
= 0V, V
AB
= 2V,
RE
= V
CC
, DE = 0V (Figure 7)
l
l
l
l
l
l
l
l
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C, V
CC
= 5V, T
E
= 0 unless otherwise noted (Note 2).
CONDITIONS
MIN
20
10
1
1
4
50
6
±6
12.5
70
8
100
TYP
MAX
UNITS
Mbps
ns
ns
ns
ns
ns
µs
ns
t
ZLD
, t
ZHD
, t
LZD
, Driver Enable or Disable Time
t
HZD
t
ZHSD
, t
ZLSD
t
SHDN
Driver Enable from Shutdown
Time to Shutdown
Driver in SLO Mode (SLO LOW)
f
MAXS
t
PLHDS,
t
PHLDS
Dt
PDS
t
SKEWDS
t
RDS,
t
FDS
t
ZHDS,
t
ZLDS
t
LZDS,
t
HZDS
t
ZHSDS,
t
ZLSDS
t
SHDNS
Receiver
t
PLHR
, t
PHLR
t
SKEWR
t
RR
, t
FR
Receiver Input to Output
Differential Receiver Skew
|t
PLHR
-t
PHLR
|
Receiver Output Rise or Fall Time
l
l
l
l
l
l
Maximum Data Rate
Driver Input to Output
Driver Input to Output Difference
|t
PLHR
-t
PHLR
|
Driver Output A to Output B
Driver Rise or Fall Time
Driver Enable Time
Driver Disable Time
Driver Enable from Shutdown
Time to Shutdown
l
l
l
l
l
l
l
l
l
l
250
0.95
50
200
200
0.9
1.5
500
±500
±750
1.5
300
70
8
500
50
1
3
70
6
12.5
50
8
100
kbps
µs
ns
ns
ns
µs
ns
ns
µs
ns
ns
ns
ns
ns
µs
µs
t
ZLR
, t
ZHR
, t
LZR
, Receiver Enable/Disable
t
HZR
t
ZHSR
, t
ZLSR
t
RTEN
, t
RTZ
Receiver Enable from Shutdown
Termination Enable or Disable Time
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime..
Note 2:
All currents into device pins are positive; all currents out of device
pins are negative. All voltages are referenced to device ground unless
otherwise specified.
Note 3:
Maximum data rate is guaranteed by other measured parameters
and is not tested directly.
Note 4:
This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may result in device degradation or failure.
285961fc
4
LTC2859/LTC2861
TesT circuiTs
Y
GND
DI
OR
V
CC
DRIVER
Z
+
V
OD
–
Y
GND
OR
DI
V
CC
I
OSD
DRIVER
Z
R
R
+
V
OC
–
+
–
2859/61 F01-2
–7V to +12V
Figure 1. Driver DC Characteristics
Figure 2. Driver Output Short-Circuit Current
Y
DI
DRIVER
Z
R
DIFF
C
L
C
L
DI
V
CC
OV
t
PLHD
,
t
PLHDS
V
O
1/2 V
O
t
SKEWD
, t
SKEWDS
t
PHLD
,
t
PHLDS
Y, Z
(Y-Z)
90%
10%
0
t
RD
,
t
RDS
0
90%
10%
t
FD
,
t
FDS
2859/61 F03
Figure 3. Driver Timing Measurement
R
L
Y
V
CC
OR DI
GND
DRIVER
Z
DE
C
L
R
L
C
L
GND
OR
V
CC
V
CC
DE
OV
V
CC
V
OL
V
OH
OV
V
O
1/2 V
CC
t
ZLD
,
t
ZLDS
,
t
ZLSD
,
t
ZLSDS
1/2 V
CC
Y or Z
V
CC
OR
GND
t
LZD
,
t
LZDS
0.5V
t
HZD
,
t
HZDS,
t
SHDN,
t
SHDNS
0.5V
Z or Y
1/2 V
CC
t
ZHD
,
t
ZHDS
,
t
ZHSD
,
t
ZHSDS
2859/61 F04
Figure 4. Driver Enable and Disable Timing Measurement
(1) Low power consumption is not required everywhere; do you really care about power consumption? Are all your peripherals low power?
(2) Low power consumption is conditional; for a 16M 430, how many ...
I would like to ask, the principle of the lie detectors used in movies should be to measure the skin resistance between the index finger and the middle finger.I can find some simple lie detector circu...
I would like to introduce a good forum to all my colleagues. It has many free VIP accounts and passwords for QIKAN, CNKI, Wanfang and Chaoxing. [url=http://www.lwheart.cn/bbs/index.php?fromuser=121555...
LCD configuration has DE mode and HV mode, which can be set by hardware on LCD driver chip. But in the device tree code of Linux kernel driver, how to distinguish DE mode and HV line field synchroniza...
1. The DDK help document says that read and write requests are completed by function drivers, not by bus drivers. 2. The DDK also says that only bus drivers are suitable to provide StarIO routines, in...
1. Interrupt nesting, the control bit of the priority 430 general interrupt is the GIE bit in the status register (this bit is in the SR register). When this bit is in the reset state, all maskable in...
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
Long ago, the lifespan of cars in my country was 15 years. Once a car reached 15 years old, it was forced to be scrapped. However, the policy was later changed. As long as the car does not exceed 6...[Details]
According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
introduction
The concept of the smart home is gradually developing and gaining market acceptance. We believe its ultimate form lies in the interconnection of all home appliances through open i...[Details]
Electric vehicles are now widespread, but they've brought with them a host of problems, the most prominent of which is charging. Small electric vehicles (EVs) are a new form of transportation in a ...[Details]
In the field of intelligent driving, regulations are becoming increasingly stringent, and the technical threshold continues to rise. Especially after the traffic accident in March 2025, the Ministr...[Details]
With the increasing popularity of automated equipment, linear modules, a common auxiliary device for automated equipment, have also seen a bright future. In particular, in recent years, many small ...[Details]
In daily life, when we purchase a transformer, we are faced with the installation and wiring procedures. Generally speaking, large transformers such as power transformers are equipped with speciali...[Details]
Methods of DC motor speed regulation:
1. The voltage regulator can be used to change the input voltage and speed directly, which is often used for large kilowatt-level motors.
2. Thyristo...[Details]
Hair dryer structure and working principle: It is mainly used for drying and shaping hair, but it can also be used for local drying, heating and treatment in laboratories, physiotherapy rooms, ind...[Details]
Silicon Labs (also known as "Silicon Labs"), an innovative leader in low-power wireless connectivity, will showcase its cutting-edge artificial intelligence (AI) and Internet of Things (IoT) solu...[Details]
Pure electric vehicles have experienced rapid growth in recent years, and many consumers now consider them as a top choice when purchasing a car. But do you know how to choose a satisfactory and sa...[Details]
The drive shaft is a high-speed, low-support rotating body, so its dynamic balance is crucial. Generally, drive shafts undergo dynamic balancing tests and adjustments on a balancing machine before ...[Details]
Munich, Germany, August 19, 2025 –
Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, announced today that its AIROC™ CYW20829 Bluetooth® low e...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
