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L6116CC12

Description
Standard SRAM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
Categorystorage    storage   
File Size767KB,7 Pages
ManufacturerLOGIC Devices
Websitehttp://www.logicdevices.com/
Download Datasheet Parametric View All

L6116CC12 Overview

Standard SRAM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24

L6116CC12 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerLOGIC Devices
Parts packaging codeDIP
package instructionDIP, DIP24,.3
Contacts24
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time12 ns
Other featuresAUTOMATIC POWER-DOWN
I/O typeCOMMON
JESD-30 codeR-GDIP-T24
JESD-609 codee0
length31.75 mm
memory density16384 bit
Memory IC TypeSTANDARD SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of ports1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum standby current0.00015 A
Minimum standby current2 V
Maximum slew rate0.195 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
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