Hitachi Single-Chip Microcomputer
H8/3024 Series
H8/3024
HD6433024F, HD6433024TE, HD6433024FP
H8/3026
HD6433026F, HD6433026TE, HD6433026FP
H8/3024F-ZTAT™
HD64F3024F, HD64F3024TE, HD64F3024FP
H8/3026F-ZTAT™
HD64F3026F, HD64F3026TE, HD64F3026FP
Hardware Manual
ADE-602-266
Rev. 1.0
3/15/02
Hitachi, Ltd.
Cautions
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patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
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without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
The H8/3024 Series is a high-performance single-chip microcomputer that integrates peripheral
functions necessary for system configuration with an H8/300H CPU featuring a 32-bit internal
architecture as its core.
The on-chip peripheral functions include ROM, RAM, 16-bit timers, 8-bit timers, a programmable
timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI),
a D/A converter, an A/D converter, and I/O ports, providing an ideal configuration as a
microcomputer for embedding in sophisticated control systems. Flash memory (F-ZTAT™*) and
mask ROM are available as on-chip ROM, enabling users to respond quickly and flexibly to
changing application specifications and the demands of the transition from initial to full-fledged
volume production.
Note: * F-ZTAT is a trademark of Hitachi, Ltd.
Intended Readership: This manual is intended for users undertaking the design of an application
system using the H8/3024 Series. Readers using this manual require a basic
knowledge of electrical circuits, logic circuits, and microcomputers.
Purpose:
The purpose of this manual is to give users an understanding of the hardware
functions and electrical characteristics of the H8/3024 Series. Details of
execution instructions can be found in the H8/300H Series Programming
Manual, which should be read in conjunction with the present manual.
Using this Manual:
•
For an overall understanding of the H8/3024 Series's functions
Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system
control functions, peripheral functions, and electrical characteristics.
•
For a detailed understanding of CPU functions
Refer to the separate publication H8/300H Series Programming Manual.
Note on bit notation: Bits are shown in high-to-low order from left to right.
•
For a detailed understanding of a register when its name is known
The addresses, bits, and initial values of the registers are summarized in appendix B, Internal
I/O Registers.
Related Material:
The latest information is available at our Web Site. Please make sure that you
have the most up-to-date information available.
(http://www.hitachisemiconductor.com/)
User's Manuals on the H8/3024:
Manual Title
H8/3024 Hardware Manual
H8/300H Series Programming Manual
ADE No.
This manual
ADE-602-053
Users manuals for development tools:
Manual Title
C/C++ Compiler, Assembler, Optimizing Linkage Editor User’s Manual
H8S, H8/300 Series Simulator/Debugger User’s Manual
Hitachi Embedded Workshop User’s Manual
H8S, H8/300 Series Hitachi Embedded Workshop, Hitachi Debugging
Interface User’s Manual
ADE No.
ADE-702-247
ADE-702-037
ADE-702-201
ADE-702-231
Application Note:
Manual Title
H8/300H for CPU Application Note
H8/300H On-Chip Supporting Modules Application Note
H8/300H Technical Q&A
ADE No.
ADE-502-033
ADE-502-035
ADE-502-038
Comparison of H8/3024 Series Product Specifications
There are four members of the H8/3024 Series: the H8/3024F-ZTAT and H8/3026F-ZTAT (all
with on-chip flash memory), and the H8/3024 mask ROM version and H8/3026 mask ROM
version.
The specifications of these products are compared below.
H8/3024F-ZTAT
Product
specifications
Product code
Pin arrange-
ment
RAM size
ROM size
Address
output
functions
Flash memory
Electrical
characteristics
(operating
frequency)
See section 18, Flash
Memory
4 kbytes
128 kbytes
H8/3026F-ZTAT
H8/3024 Mask ROM
Version
H8/3026 Mask ROM
Version
On-chip single-power-supply flash memory
HD64F3024
HD64F3026
Mask ROM version
HD6433024
HD6433026
See figures 1.2 and 1.3, Pin Arrangement, in section 1
8 kbytes
256 kbytes
4 kbytes
128 kbytes
8 kbytes
256 kbytes
Address update mode 1 or 2 selectable
See 6.3.5, Address Output Method, in section 6
See section 17, Flash
Memory
—
—
See section 21, Electrical Characteristics
2 to 25 MHz
Registers
See table B.1, Comparison of H8/3024 Series Internal I/O Register Specifications,
in appendix B
See appendix B.2,
Address List
See appendix B.1,
Address List
See appendix B.2,
Address List
See appendix B.1,
Address List