|
DAC5687IPZPG4 |
DAC5687IPZP |
DAC5687IPZPR |
| Description |
Dual-Channel, 16-Bit, 500-MSPS, 1x-8x Interpolating Digital-to-Analog Converter (DAC) 100-HTQFP -40 to 85 |
Dual-Channel, 16-Bit, 500-MSPS, 1x-8x Interpolating Digital-to-Analog Converter (DAC) 100-HTQFP -40 to 85 |
Dual-Channel, 16-Bit, 500-MSPS, 1x-8x Interpolating Digital-to-Analog Converter (DAC) 100-HTQFP -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
QFP |
QFP |
QFP |
| package instruction |
HTQFP-100 |
HTFQFP, TQFP100,.63SQ |
HTQFP-100 |
| Contacts |
100 |
100 |
100 |
| Reach Compliance Code |
compli |
compli |
compliant |
| Factory Lead Time |
1 week |
1 week |
6 weeks |
| Maximum analog output voltage |
4.1 V |
4.1 V |
4.1 V |
| Minimum analog output voltage |
2.5 V |
2.5 V |
2.5 V |
| Converter type |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
| Enter bit code |
OFFSET BINARY, 2'S COMPLEMENT BINARY |
OFFSET BINARY, 2\'S COMPLEMENT BINARY |
OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| Input format |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
| JESD-30 code |
S-PQFP-G100 |
S-PQFP-G100 |
S-PQFP-G100 |
| JESD-609 code |
e4 |
e4 |
e4 |
| length |
14 mm |
14 mm |
14 mm |
| Humidity sensitivity level |
3 |
3 |
3 |
| Number of digits |
16 |
16 |
16 |
| Number of functions |
1 |
1 |
1 |
| Number of terminals |
100 |
100 |
100 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HTFQFP |
HTFQFP |
HTFQFP |
| Encapsulate equivalent code |
TQFP100,.63SQ |
TQFP100,.63SQ |
TQFP100,.63SQ |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
| Package form |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
| power supply |
1.8,3.3 V |
1.8,3.3 V |
1.8,3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Sampling rate |
500 MHz |
500 MHz |
500 MHz |
| Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
| Nominal settling time (tstl) |
0.0104 µs |
0.0104 µs |
0.0104 µs |
| Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
14 mm |
14 mm |
14 mm |
| Base Number Matches |
1 |
1 |
1 |