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SCANSTA112SMX

Description
7-port Multidrop IEEE 1149.1 (JTAG) Multiplexer 100-NFBGA -40 to 85
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,22 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SCANSTA112SMX Overview

7-port Multidrop IEEE 1149.1 (JTAG) Multiplexer 100-NFBGA -40 to 85

SCANSTA112SMX Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it Rohs certified?incompatible
MakerTexas Instruments
Parts packaging codeBGA
package instructionLFBGA, BGA100,10X10,32
Contacts100
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time6 weeks
External data bus width
JESD-30 codeS-PBGA-B100
JESD-609 codee0
length10 mm
Humidity sensitivity level3
Number of terminals100
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA100,10X10,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)235
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width10 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT

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Description 7-port Multidrop IEEE 1149.1 (JTAG) Multiplexer 100-NFBGA -40 to 85 7-port Multidrop IEEE 1149.1 (JTAG) Multiplexer 100-NFBGA -40 to 85 7-port Multidrop IEEE 1149.1 (JTAG) Multiplexer 100-TQFP -40 to 85 Encoders, Decoders, Multiplexers & Demultiplexers 7-port Multidrop IEEE 1149.1 (JTAG) Multiplexer 100-TQFP -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA BGA QFP QFP
package instruction LFBGA, BGA100,10X10,32 LFBGA, BGA100,10X10,32 TFQFP, TQFP100,.63SQ TFQFP, TQFP100,.63SQ
Contacts 100 100 100 100
Reach Compliance Code not_compliant _compli _compli _compli
ECCN code EAR99 EAR99 EAR99 EAR99
Factory Lead Time 6 weeks 1 week 1 week 1 week
JESD-30 code S-PBGA-B100 S-PBGA-B100 S-PQFP-G100 S-PQFP-G100
JESD-609 code e0 e0 e0 e0
length 10 mm 10 mm 14 mm 14 mm
Humidity sensitivity level 3 3 3 3
Number of terminals 100 100 100 100
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA TFQFP TFQFP
Encapsulate equivalent code BGA100,10X10,32 BGA100,10X10,32 TQFP100,.63SQ TQFP100,.63SQ
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 235 235 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.5 mm 1.5 mm 1.2 mm 1.2 mm
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10 mm 10 mm 14 mm 14 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
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