*** Resistance value measured with ≤10 % rated current at 25 °C ambient. Tolerance ±30 %.
**** 20 A – 60 A: Melting I
2
t calculated at 10 times rated current. 80 A – 100 A: Melting I
2
t calculated at 6 times rated current.
No.
1
2
Test
Solderability
Resistance to
soldering heat
Temperature setup: 235 ±5 °C
Time setup: 30 sec.
Test Condition
Temperature setup: 235 +0 / -5 °C
Time setup: 10 sec.
Requirement
After test terminal electrode wetting
area must be greater than 95 %
DCR change ≤ ±15 %
DCR change ≤ ±15 %
No mechanical damage
Test Reference
IEC 68-2-58
IEC 68-2-58
MIL-STD-202G
Method 107G
Test Condition B
MIL-STD-202G
Method 103B
Test Condition A
MIL-STD-202G
Method 101E
Test Condition A
IEC 60127-4
MIL-STD-202G
Method 201A
3
Thermal shock
Temperature setup:
25 °C ~ -65 °C ~ 25 °C ~ 125 °C
Time setup: -65 °C (30 min)
~ 25 °C (5 min) ~ 125 °C (30 min)
~ 25 °C (5 min), 5 cycles
Heat (85 ±0.5 °C)
High Humidity (85 ±1 % RH)
240 hours
Salt spray concentration: 5 ±1 %
Test liquid temperature: 35 ±0.5 °C
96 hours
The board shall be bent by 1 mm
at a rate of 1 mm/sec.
Frequency setup: 10 ~ 55 ~ 10 Hz
Time setup: 1 Minute/cycle
(X-Y-Z, 120 cycles, 6 hours)
4
5
6
7
Humidity unload
Salt spray
Bending
Vibration
DCR change ≤ ±15 %
No mechanical damage
DCR change ≤ ±15 %
No mechanical damage
DCR change ≤ ±15 %
DCR change ≤ ±15 %
No mechanical damage
WARNING Cancer and Reproductive Harm -
www.P65Warnings.ca.gov
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and
Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
SinglFuse
™
SF-2923UC-C Series Applications
n
Li-ion Battery Packs
n
Energy Storage Systems (ESS)
n
Power Tools
n
Electric Assist Bicycles
n
Servers and Routers
n
Uninterruptible Power Supplies (UPS)
n
Power Distribution Units (PDUs)
n
Power Factor Correction (PFC)
SF-2923UC-C Series – Ultra-High Current SMD Fuses
Environmental Characteristics
Operating Temperature................................................................................................................................................................ -55 °C to +125 °C
Storage Conditions
Temperature ............................................................................................................................................................................ +15 °C to +30 °C
Humidity.........................................................................................................................................................................................20 % to 70 %
Shelf Life..........................................................................................................................................................2 years from manufacturing date
ESD Classification (HBM)............................................................................................................................................................................ Class 6
Typical Part Marking
Represents total content. Layout may vary.
How to Order
Agency Recognition
SF - 2923 UC 20 C - 2
SinglFuse™
Product Designator
UL File Number ............................ E500949
U20
Rated Current
20 A
30 A
40 A
50 A
60 A
80 A
100 A
Part Marking
U20
U30
U40
U50
U60
U80
U100
SMD Footprint
2923 = EIA 2923
(7358 metric)
Construction
CERAMIC COVER
Fuse Blow Type
UC = Ultra-High Current
Rated Current
20 ~ 100 (20 A ~ 100 A)
U2
0
Structure Type
C = Ceramic Cube Housing
Packaging Type
- 2 = Tape & Reel
FUSE ELEMENT /
TERMINAL
Packaging Quantity
1,000 pieces per 13-inch reel
Recommended Pad Layout
4.40
(.173)
Product Dimensions
5.80 ± 0.30
(.228 ± .012)
U20
4.20 ± 0.20
(.165 ± .008)
4.00 ± 0.20
(.157 ± .008)
1.30 ± 0.20
(.051 ± .008)
5.80
(.228)
7.30 ± 0.50
(.287 ± .020)
2.70
(.106)
DIMENSIONS:
MM
(INCHES)
DIMENSIONS:
MM
(INCHES)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
SF-2923UC-C Series – Ultra-High Current SMD Fuses
Current Rating Thermal Derating Curve
120
100
DERATING (%)
80
60
40
25 °C
20
0
-60
-40
-20
0
20
40
60
80
100
120
140
AMBIENT TEMPERATURE (°C)
Pulse Cycle Withstand Capability
100,000
NUMBER OF PULSES
10,000
1,000
100
10 %
100 %
PULSE I
2
t / AVERAGE MELTING I
2
t
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
SF-2923UC-C Series – Ultra-High Current SMD Fuses
Solder Reflow Recommendations
tp
RAMP-UP
TL
CRITICAL ZONE
T L TO TP
TP
Temperature
TS MAX.
tL
RAMP-DOWN
TS MIN.
ts
PREHEAT
Liquidous Temperature (T
L
)
Time (t
L
) maintained above T
L
Peak Package Body
Temperature (T
p
)
Ramp Up Rate (T
smax
to T
L
)
Ramp Up Rate (T
L
to T
p
)
Profile Feature
Preheat / Soak:
Temperature Min. (T
smin
)
Temperature Max. (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
Pb-Free Assembly
150 °C
200 °C
60~180 seconds
3 °C / second max.
5 °C / second max.
217 °C
60~90 seconds
235 °C ± 5 °C
20~30 seconds*
6 °C / second max.
8 minutes max.
240 °C
25 °C
t 25 *C TO PEAK
Time
Time within 5 °C of actual peak
temperature (T
p
)
Ramp Down Rate (T
p
to T
L
)
Do not exceed
Time 25 °C to Peak Temperature
* Tolerance for peak profile temperature (Tp ) is defined as a
supplier minimum and a user maximum.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
SF-2923UC-C
mm SMD Trimming Potentiometer
3312 - 2
Series – Ultra-High Current SMD Fuses
Average Pre-Arcing Time vs. Current Curves
50 A A
50
40 A A
40
30
30 A A
20 A A
20
60 A A
60
80 A A
80
100 100 A
A
100 100 A
A
80 A A
80
Average I
2
t vs. t Curves
100100
1000000
1000000
60
60 A A
50 A A
50
40 A A
40
10 10
30 A A
30
PRE-ARCING TIME (SECONDS)
PRE-ARCING TIME (SECONDS)
100000
100000
20 A A
20
1 1
0.1 0.1
0.01
0.01
0.001
0.001
10 10
I
2
t (A
2
s)
I
2
t (A
2
s)
10000
10000
1000
1000
100100
1000
1000
100100
0.001
0.001
0.01
0.01
0.1 0.1
1 1
10 10
100100
CURRENT (A)(A)
CURRENT
TIME (SECONDS)
TIME (SECONDS)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
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I always get an error when building a dosfs file system on an SD card:
The code is as follows
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FPGA/CPLD
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