The UT54ACS151 and the UT54ACTS151 are data multiplex-
ers that provide full binary decoding to select one of eight data
sources. The strobe input, G, must be at a low logic level to
enable the inputs. A high level at the strobe terminal forces the
Y output high and the Y output low.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
INPUTS
SELECT
C
X
L
L
L
L
H
H
H
H
B
X
L
L
H
H
L
L
H
H
A
X
L
H
L
H
L
H
L
H
STROBE
G
H
L
L
L
L
L
L
L
L
Y
L
D0
D1
D2
D3
D4
D5
D6
D7
Y
H
D0
D1
D2
D3
D4
D5
D6
D7
OUTPUT
PINOUTS
16-Pin DIP
Top View
D3
D2
D1
D0
Y
Y
G
V
ss
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
D4
D5
D6
D7
A
B
C
16-Lead Flatpack
Top View
D3
D2
D1
D0
Y
Y
G
V
ss
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
D4
D5
D6
D7
A
B
C
LOGIC SYMBOL
(7)
G
(11)
A
(10)
B
(9)
C
(4)
D0
(3)
D1
(2)
D2
(1)
D3
(15)
D4
(14)
D5
(13)
D6
(12)
D7
MUX
E
N
0
1
2
0
1
2
3
4
5
6
(5)
(6)
Y
Y
G
---
0
3
H= high level, L = low level, X = irrelevant
D0, D1... D7 = the level of the D respective input
Note:
1. Logic symbol in accordance with ANSI/IEEE Std 91-1984 and IEC
Publication 617-12.
1
LOGIC DIAGRAM
STROBE G
D0
(7)
(4)
D1
(3)
D2
(2)
D3
DATA
D4
(1)
(5)
(6)
(15)
Y
OUTPUTS
Y
D5
(14)
D6
(13)
D7
(12)
A
DATA
SELECT
B
C
(11)
(10)
(9)
2
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
°C
3
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Short-circuit output current
2 ,4
ACTS/ACS
Output current
10
(Sink)
I
OH
Output current
10
(Source)
P
total
I
DDQ
ΔI
DDQ
Power dissipation
2, 8, 9
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 8.0mA
I
OL
= 100μA
I
OH
= -8.0mA
I
OH
= -100μA
V
O
= V
DD
and V
SS
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
C
L
= 50pF
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
2.3
10
1.6
mW/
MHz
μA
mA
-8
mA
.7V
DD
V
DD
- 0.25
-200
8
200
.5V
DD
.7V
DD
-1
1
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
0.40
0.25
V
V
OH
V
I
OS
I
OL
mA
mA
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
After dinner tonight, I went online and saw that TX and 360 were arguing with each other, forcing users to choose between the two. It's really annoying!In my opinion, this is just TX trying to scare u...
Hello everyone, I just bought HC05 Bluetooth and 5529, and want to use them for car control. I first connected Bluetooth and computer with USB to TTL, and the debugging was fine. But when I connected ...
Live playback: It’s coming, typical applications in the era of the Internet of Things: Maxim’s easy-to-understand low-power MCU : https://training.eeworld.com.cn/course/5465...
1 Introduction Space optical communication technology is a hot topic in current research and can be applied to many fields, including: low-orbit satellite and high-orbit satellite (LEO-GEO) communicat...
As the first global event in the MWC series to return to offline, 2021 MWC Shanghai has launched an online platform, My MWCS Online, so that attendees and exhibitors will be able to have both offline ...
The core of a machine vision system is image acquisition and processing. All information comes from images, and image quality is crucial to the entire vision system. A good image can improve the st...[Details]
While
the solid-state battery
industry is still engaged in a long technological marathon for
the "ultimate solution" for
electric vehicles
, some companies have begun looking for mor...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
The structure of an LCD TV primarily consists of the LCD display module, power module, driver module (primarily including the main driver board and tuner board), and keypad module. LCD display modu...[Details]
Capable of providing precise and efficient thermal management for artificial intelligence computing power, intelligent sensing and autonomous driving systems
Shenzhen, ...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
For autonomous vehicles to safely navigate the road, they must identify far more complex objects than just traffic lights, pedestrians, and other familiar objects. Among these obstacles is a crucia...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
introduction
The concept of the smart home is gradually developing and gaining market acceptance. We believe its ultimate form lies in the interconnection of all home appliances through open i...[Details]
Smartphones have become essential digital devices, and the growing number of smartphone-centric applications is enriching people's lives. As users, they desire a better app experience and a wider r...[Details]
Electric vehicles are now widespread, but they've brought with them a host of problems, the most prominent of which is charging. Small electric vehicles (EVs) are a new form of transportation in a ...[Details]
Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
There are basically three causes of spontaneous combustion of electric vehicles: The first is that the battery components are punctured or suffer fatal damage due to a collision accident, and part ...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Coal mines typically contain gas and coal dust. When gas and coal dust reach a certain concentration, they can cause explosions. Electrical equipment generates arcs during normal operation or durin...[Details]
Test/Measurement
京公网安备 11010802033920号
EEWORLD
