CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications
PARAMETER
T
C
= 25
o
C, Unless Otherwise Specified
SYMBOL
BV
DSS
V
GS(TH)
TEST CONDITIONS
I
D
= 1mA, V
GS
= 0V
V
GS
= V
DS
,
I
D
= 1mA
T
C
= -55
o
C
T
C
= 25
o
C
T
C
= 125
o
C
T
C
= 25
o
C
T
C
= 125
o
C
T
C
= 25
o
C
T
C
= 125
o
C
T
C
= 25
o
C
T
C
= 125
o
C
MIN
250
-
2.0
1.0
-
-
-
-
-
-
-
-
-
-
-
V
GS
= 0V to 12V
V
DD
= 125V,
I
D
= 43A
-
-
-
V
GS
= 0V to 20V
V
GS
= 0V to 2V
I
D
= 43A, V
DS
= 15V
V
DS
= 25V, V
GS
= 0V,
f = 1MHz
-
-
-
-
-
-
-
TYP
-
-
-
-
-
-
-
-
-
0.041
-
-
-
-
-
115
35
35
195
12
7
6100
875
35
-
MAX
-
5.5
4.5
-
25
250
100
200
2.15
0.047
0.092
35
70
70
15
140
45
45
-
-
-
-
-
-
0.65
UNITS
V
V
V
V
µA
µA
nA
nA
V
Ω
Ω
ns
ns
ns
ns
nC
nC
nC
nC
nC
V
pF
pF
pF
o
C/W
Drain to Source Breakdown Voltage
Gate Threshold Voltage
Zero Gate Voltage Drain Current
I
DSS
I
GSS
V
DS(ON)
r
DS(ON)12
t
d(ON)
t
r
t
d(OFF)
t
f
Q
g(12)
Q
gs
Q
gd
Q
g(20)
Q
g(TH)
V
(PLATEAU)
C
ISS
C
OSS
C
RSS
R
θ
JC
V
DS
= 200V,
V
GS
= 0V
V
GS
=
±30V
V
GS
= 12V, I
D
= 43A
I
D
= 27A,
V
GS
= 12V
Gate to Source Leakage Current
Drain to Source On-State Voltage
Drain to Source On Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate Charge Source
Gate Charge Drain
Gate Charge at 20V
Threshold Gate Charge
Plateau Voltage
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Thermal Resistance Junction to Case
V
DD
= 125V, I
D
= 43A,
R
L
= 2.9Ω, V
GS
= 12V,
R
GS
= 2.35Ω
2
FSPJ264R, FSPJ264F
Source to Drain Diode Specifications
PARAMETER
Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
SYMBOL
V
SD
t
rr
Q
RR
T
C
= 25
o
C, Unless Otherwise Specified
MIN
PARAMETER
Drain to Source Breakdown Volts
Gate to Source Threshold Volts
Gate to Body Leakage
Zero Gate Leakage
Drain to Source On-State Volts
Drain to Source On Resistance
NOTES:
1. Pulse test, 300µs Max.
2. Absolute value.
3. Insitu Gamma bias must be sampled for both V
GS
= 12V, V
DS
= 0V and V
GS
= 0V, V
DS
= 80% BV
DSS
.
(Note 3)
(Note 3)
(Notes 2, 3)
(Note 3)
(Notes 1, 3)
(Notes 1, 3)
SYMBOL
BV
DSS
V
GS(TH)
I
GSS
I
DSS
V
DS(ON)
r
DS(ON)12
TEST CONDITIONS
V
GS
= 0, I
D
= 1mA
V
GS
= V
DS
, I
D
= 1mA
V
GS
=
±30V,
V
DS
= 0V
V
GS
= 0, V
DS
= 200V
V
GS
= 12V, I
D
= 43A
V
GS
= 12V, I
D
= 27A
MAX
MIN
MAX
UNITS
V
V
nA
µA
V
Ω
100K RAD
250
-
2.0
4.5
-
100
-
-
-
25
2.15
0.047
300K RAD
250
-
1.5
4.5
-
100
-
-
-
50
2.62
0.056
TEST CONDITIONS
I
SD
= 43A
I
SD
= 43A, dI
SD
/dt = 100A/µs
MIN
-
-
-
TYP
-
-
6.8
MAX
1.2
590
-
UNITS
V
ns
µC
Electrical Specifications up to 300K RAD
Single Event Effects (SEB, SEGR)
Note 4
ENVIRONMENT
(NOTE 5)
ION
TYPICAL LET
TYPICAL
SPECIES
(MeV/mg/cm)
RANGE (µ)
Br
37
36
Br
I
I
Au
Au
37
60
60
82
82
36
32
32
28
28
APPLIED
V
GS
BIAS
(V)
-10
-15
-2
-8
0
-5
(NOTE 6)
MAXIMUM
V
DS
BIAS (V)
250
200
200
150
150
100
TEST
Single Event Effects Safe Operating Area
SYMBOL
SEESOA
NOTES:
4. Testing conducted at Brookhaven National Labs.
5. Fluence = 1E5 ions/cm
2
(Typical), T = 25
o
C.
6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR).
Performance Curves
Unless Otherwise Specified
LET = 37MeV/mg/cm
2
, RANGE = 36µ
LET = 60MeV/mg/cm
2
, RANGE = 32µ
LET = 82MeV/mg/cm
2
, RANGE = 28µ
280
240
200
V
DS
(V)
V
DS
(V)
160
120
80
40
0
0
-4
-8
V
GS
(V)
-12
-16
-20
FLUENCE = 1E5 IONS/cm
2
(TYPICAL)
TEMP = 25
o
C
280
240
200
160
120
80
LET = 82 GOLD
40
0
0
-5
-10
-15
V
GS
(V)
-20
-25
-30
LET = 60 IODINE
LET = 37 BROMINE
FIGURE 1. SINGLE EVENT EFFECTS SAFE OPERATING AREA
FIGURE 2. TYPICAL SEE SIGNATURE CURVE
3
FSPJ264R, FSPJ264F
Performance Curves
1E-3
LIMITING INDUCTANCE (HENRY)
50
1E-4
ILM = 10A
30A
1E-5
100A
300A
1E-6
10
I
D
, DRAIN (A)
Unless Otherwise Specified
(Continued)
40
30
20
1E-7
10
30
100
DRAIN SUPPLY (V)
300
1000
0
-50
0
50
100
150
T
C
, CASE TEMPERATURE (
o
C)
FIGURE 3. TYPICAL DRAIN INDUCTANCE REQUIRED TO
LIMIT GAMMA DOT CURRENT TO I
AS
FIGURE 4. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE
500
T
C
= 25
o
C
I
D
, DRAIN CURRENT (A)
100
12V
Q
G
10
100µs
Q
GS
1ms
1
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
10ms
V
G
Q
GD
0.1
1
10
100
1000
CHARGE
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
FIGURE 6. BASIC GATE CHARGE WAVEFORM
2.5
PULSE DURATION = 250ms, V
GS
= 12V, I
D
= 27A
2.0
NORMALIZED r
DS(ON)
I
D
, DRAIN TO SOURCE CURRENT (A)
200
DESCENDING ORDER
V
GS
= 14V
V
GS
= 12V
V
GS
= 10V
V
GS
= 8V
V
GS
= 6V
V
GS
= 6 VOLTS
160
1.5
120
1.0
80
0.5
40
0.0
-80
0
-40
0
40
80
120
160
T
J
, JUNCTION TEMPERATURE (
o
C)
0
2
4
6
8
10
12
14
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
FIGURE 7. TYPICAL NORMALIZED r
DS(ON)
vs JUNCTION
TEMPERATURE
FIGURE 8. TYPICAL OUTPUT CHARACTERISTICS
4
FSPJ264R, FSPJ264F
Performance Curves
NORMALIZED THERMAL RESPONSE (Z
qJC
)
10
1
Unless Otherwise Specified
(Continued)
10
0
0.5
10
-1
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
P
DM
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θJC
+ T
C
10
-4
10
-3
10
-2
10
-1
10
0
t
1
10
-2
10
-3
10
-5
t
2
10
1
t, RECTANGULAR PULSE DURATION (s)
FIGURE 9. NORMALIZED MAXIMUM TRANSIENT THERMAL RESPONSE
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