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DRV2604LDGST

Description
DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 10-VSSOP -40 to 85
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size3MB,69 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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DRV2604LDGST Overview

DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 10-VSSOP -40 to 85

DRV2604LDGST Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
package instructionTSSOP,
Reach Compliance Codecompli
Factory Lead Time6 weeks
Samacsys DescriptiMotor / Motion / Ignition Controllers & Drivers Low Voltage Haptic Drive
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeS-PDSO-G10
length3 mm
Humidity sensitivity level2
Number of functions1
Number of terminals10
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Maximum seat height1.1 mm
Maximum supply voltage5.2 V
Minimum supply voltage2 V
Nominal supply voltage3.6 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
width3 mm

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Description DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 10-VSSOP -40 to 85 DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 10-VSSOP -40 to 85 DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 9-DSBGA -40 to 85 DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 9-DSBGA -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction TSSOP, TSSOP, VFBGA, VFBGA,
Reach Compliance Code compli compli compli compliant
Factory Lead Time 6 weeks 6 weeks 16 weeks 16 weeks
Interface integrated circuit type INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 code S-PDSO-G10 S-PDSO-G10 S-XBGA-B9 S-XBGA-B9
length 3 mm 3 mm 1.44 mm 1.44 mm
Humidity sensitivity level 2 2 1 1
Number of functions 1 1 1 1
Number of terminals 10 10 9 9
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED
encapsulated code TSSOP TSSOP VFBGA VFBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Maximum seat height 1.1 mm 1.1 mm 0.625 mm 0.625 mm
Maximum supply voltage 5.2 V 5.2 V 5.2 V 5.2 V
Minimum supply voltage 2 V 2 V 2 V 2 V
Nominal supply voltage 3.6 V 3.6 V 3.6 V 3.6 V
surface mount YES YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL BOTTOM BOTTOM
width 3 mm 3 mm 1.44 mm 1.44 mm
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