DRV2604LYZFR datasheet, PDF - EEWORLD Datasheet

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DRV2604LYZFR: DescriptionDRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 9-DSBGA -40 to 85; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size3MB，69 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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DRV2604LYZFR Overview

DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 9-DSBGA -40 to 85

DRV2604LYZFR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	9
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	16 weeks
Interface integrated circuit type	INTERFACE CIRCUIT
JESD-30 code	S-XBGA-B9
JESD-609 code	e1
length	1.44 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	9
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Maximum seat height	0.625 mm
Maximum supply voltage	5.2 V
Minimum supply voltage	2 V
Nominal supply voltage	3.6 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
width	1.44 mm

DRV2604LYZFR Related Products

	DRV2604LYZFR	DRV2604LDGSR	DRV2604LDGST	DRV2604LYZFT
Description	DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 9-DSBGA -40 to 85	DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 10-VSSOP -40 to 85	DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 10-VSSOP -40 to 85	DRV2604L Low Voltage Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture 9-DSBGA -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	VFBGA,	TSSOP,	TSSOP,	VFBGA,
Reach Compliance Code	compli	compli	compli	compliant
Factory Lead Time	16 weeks	6 weeks	6 weeks	16 weeks
Interface integrated circuit type	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT
JESD-30 code	S-XBGA-B9	S-PDSO-G10	S-PDSO-G10	S-XBGA-B9
length	1.44 mm	3 mm	3 mm	1.44 mm
Humidity sensitivity level	1	2	2	1
Number of functions	1	1	1	1
Number of terminals	9	10	10	9
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	VFBGA	TSSOP	TSSOP	VFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Maximum seat height	0.625 mm	1.1 mm	1.1 mm	0.625 mm
Maximum supply voltage	5.2 V	5.2 V	5.2 V	5.2 V
Minimum supply voltage	2 V	2 V	2 V	2 V
Nominal supply voltage	3.6 V	3.6 V	3.6 V	3.6 V
surface mount	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	GULL WING	BALL
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	DUAL	DUAL	BOTTOM
width	1.44 mm	3 mm	3 mm	1.44 mm

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