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LMC567CMX

Description
Communication ICs - Various
CategoryWireless rf/communication    Telecom circuit   
File Size177KB,7 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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Communication ICs - Various

LMC567CMX Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTexas Instruments
Parts packaging codeSOIC
package instruction0.150 INCH, PLASTIC, SOP-8
Contacts8
Reach Compliance Code_compli
Is SamacsysN
JESD-30 codeR-PDSO-G8
JESD-609 codee0
length4.9 mm
Humidity sensitivity level1
Number of functions1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-25 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)235
Certification statusNot Qualified
Maximum seat height1.75 mm
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesTONE DECODER CIRCUIT
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
Base Number Matches1

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Description Communication ICs - Various Communication ICs - Various Communication ICs - Various
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments
Parts packaging code SOIC DIP SOIC
package instruction 0.150 INCH, PLASTIC, SOP-8 DIP, SOP,
Contacts 8 8 8
Reach Compliance Code _compli _compli _compli
JESD-30 code R-PDSO-G8 R-PDIP-T8 R-PDSO-G8
JESD-609 code e0 e0 e0
length 4.9 mm 9.817 mm 4.9 mm
Humidity sensitivity level 1 1 1
Number of functions 1 1 1
Number of terminals 8 8 8
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -25 °C -25 °C -25 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 235 NOT SPECIFIED 235
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 5.08 mm 1.75 mm
Nominal supply voltage 5 V 5 V 5 V
surface mount YES NO YES
technology CMOS CMOS CMOS
Telecom integrated circuit types TONE DECODER CIRCUIT TONE DECODER CIRCUIT TONE DECODER CIRCUIT
Temperature level OTHER OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3.9 mm 7.62 mm 3.9 mm
ECCN code - 5A991.G 5A991.G
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