TAS3208IPZP datasheet, PDF - EEWORLD Datasheet

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TAS3208IPZP: DescriptionDual Core Digital Audio Processor 100-HTQFP -40 to 85; CategoryOther integrated circuit (IC) Consumption circuit; File Size1002KB，79 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TAS3208IPZP Overview

Dual Core Digital Audio Processor 100-HTQFP -40 to 85

TAS3208IPZP Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	QFP
package instruction	HTFQFP, TQFP100,.63SQ
Contacts	100
Reach Compliance Code	compli
Factory Lead Time	1 week
Commercial integrated circuit types	CONSUMER CIRCUIT
JESD-30 code	S-PQFP-G100
JESD-609 code	e4
length	14 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HTFQFP
Encapsulate equivalent code	TQFP100,.63SQ
Package shape	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum slew rate	200 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

TAS3208IPZP Related Products

	TAS3208IPZP	TAS3208PZP	TAS3208PZPR	TAS3208IPZPR
Description	Dual Core Digital Audio Processor 100-HTQFP -40 to 85	Dual Core Digital Audio Processor 100-HTQFP -20 to 70	Audio DSPs Dual Core Digital Audio Processor	Audio DSPs Dual Core Dig Aud Proc
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Contains lead	Contains lead
Is it Rohs certified?	conform to	conform to	conform to	conform to
Parts packaging code	QFP	QFP	QFP	QFP
package instruction	HTFQFP, TQFP100,.63SQ	HTFQFP, TQFP100,.63SQ	HTFQFP, TQFP100,.63SQ	HTFQFP, TQFP100,.63SQ
Contacts	100	100	100	100
Reach Compliance Code	compli	compli	compli	unknow
Commercial integrated circuit types	CONSUMER CIRCUIT	CONSUMER CIRCUIT	CONSUMER CIRCUIT	CONSUMER CIRCUIT
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
length	14 mm	14 mm	14 mm	14 mm
Number of functions	1	1	1	1
Number of terminals	100	100	100	100
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-20 °C	-20 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HTFQFP	HTFQFP	HTFQFP	HTFQFP
Encapsulate equivalent code	TQFP100,.63SQ	TQFP100,.63SQ	TQFP100,.63SQ	TQFP100,.63SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum slew rate	200 mA	200 mA	200 mA	200 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES
Temperature level	INDUSTRIAL	OTHER	OTHER	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm	14 mm	14 mm
JESD-609 code	e4	e4	e4	-
Humidity sensitivity level	3	3	3	-
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	-

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