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DPZ128X32VSP-30M

Description
Flash Module, 512KX8, 300ns, CPGA66, CERAMIC, PGA-66
Categorystorage    storage   
File Size99KB,3 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPZ128X32VSP-30M Overview

Flash Module, 512KX8, 300ns, CPGA66, CERAMIC, PGA-66

DPZ128X32VSP-30M Parametric

Parameter NameAttribute value
MakerB&B Electronics Manufacturing Company
Parts packaging codePGA
package instructionCERAMIC, PGA-66
Contacts66
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time300 ns
Other featuresUSER CONFIGURABLE AS 128K X 32
Spare memory width16
JESD-30 codeS-CPGA-P66
memory density4194304 bit
Memory IC TypeFLASH MODULE
memory width8
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height8.382 mm
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
typeNOR TYPE
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