10 A 3.3-V Input Bus Termination Power Module for DDR/QDR Memory 10-Surface Mount Module -40 to 85
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | DFM |
| package instruction | DIP-10 |
| Contacts | 10 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Factory Lead Time | 8 weeks |
| Is Samacsys | N |
| Other features | OUTPUT VARIES ACCORDING TO THE INPUT AND RESISTOR DIVIDER CONFIGURATION |
| Analog Integrated Circuits - Other Types | DC-DC REGULATED POWER SUPPLY MODULE |
| Certification | "UL,EN,VDE" |
| control mode | VOLTAGE-MODE |
| Efficiency (main output) | 86% |
| Maximum input voltage | 3.65 V |
| Minimum input voltage | 2.95 V |
| Nominal input voltage | 3.3 V |
| JESD-30 code | R-XDMA-X10 |
| JESD-609 code | e1 |
| length | 25.27 mm |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Output times | 1 |
| Number of terminals | 10 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Maximum output current | 10 A |
| Maximum output voltage | 1.8 V |
| Minimum output voltage | 0.55 V |
| Package body material | UNSPECIFIED |
| encapsulated code | DMA |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | 260 |
| Protect | OUTPUT OVER CURRENT |
| Certification status | Not Qualified |
| Ripple voltage (main output) | 0.077 Vrms |
| Maximum seat height | 8.75 mm |
| surface mount | NO |
| technology | HYBRID |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | UNSPECIFIED |
| Terminal pitch | 3.175 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Fine-tuning/adjustable output | YES |
| width | 15.75 mm |
| Base Number Matches | 1 |
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