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TM4C123GH6ZRBI7R

Description
High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 85
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size8MB,1471 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

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TM4C123GH6ZRBI7R Overview

High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 85

TM4C123GH6ZRBI7R Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionVFBGA,
Contacts157
Reach Compliance Codecompli
Factory Lead Time6 weeks
Has ADCYES
Address bus width
bit size32
boundary scanYES
CPU seriesCORTEX-M4F
maximum clock frequency25 MHz
DAC channelNO
DMA channelYES
External data bus width
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B157
JESD-609 codee1
length9 mm
low power modeYES
Humidity sensitivity level3
Number of DMA channels32
Number of external interrupt devices
Number of I/O lines120
Number of serial I/Os21
Number of terminals157
Number of timers12
On-chip data RAM width8
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeSQUARE
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
RAM (bytes)32768
RAM (number of words)32
rom(word)262144
ROM programmabilityFLASH
Maximum seat height1 mm
speed80 MHz
Maximum slew rate54.9 mA
Maximum supply voltage1.32 V
Minimum supply voltage1.08 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.65 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width9 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC

TM4C123GH6ZRBI7R Related Products

TM4C123GH6ZRBI7R TM4C123GH6ZRBI7 TM4C123GH6ZRBT7 TM4C123GH6ZRBT7R
Description High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 85 High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 85 High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 105 High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 105
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA BGA BGA BGA
package instruction VFBGA, VFBGA, VFBGA, VFBGA,
Contacts 157 157 157 157
Reach Compliance Code compli compli compli compli
Factory Lead Time 6 weeks 6 weeks 6 weeks 6 weeks
Has ADC YES YES YES YES
bit size 32 32 32 32
boundary scan YES YES YES YES
CPU series CORTEX-M4F CORTEX-M4F CORTEX-M4F CORTEX-M4F
maximum clock frequency 25 MHz 25 MHz 25 MHz 25 MHz
DAC channel NO NO NO NO
DMA channel YES YES YES YES
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES
JESD-30 code S-PBGA-B157 S-PBGA-B157 S-PBGA-B157 S-PBGA-B157
JESD-609 code e1 e1 e1 e1
length 9 mm 9 mm 9 mm 9 mm
low power mode YES YES YES YES
Humidity sensitivity level 3 3 3 3
Number of DMA channels 32 32 32 32
Number of I/O lines 120 120 120 120
Number of serial I/Os 21 21 21 21
Number of terminals 157 157 157 157
Number of timers 12 12 12 12
On-chip data RAM width 8 8 8 8
On-chip program ROM width 8 8 8 8
Maximum operating temperature 85 °C 85 °C 105 °C 105 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA VFBGA VFBGA VFBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260
RAM (bytes) 32768 32768 32768 32768
RAM (number of words) 32 32 32 32
rom(word) 262144 262144 262144 262144
ROM programmability FLASH FLASH FLASH FLASH
Maximum seat height 1 mm 1 mm 1 mm 1 mm
speed 80 MHz 80 MHz 80 MHz 80 MHz
Maximum slew rate 54.9 mA 58.7 mA 58.7 mA 58.7 mA
Maximum supply voltage 1.32 V 1.32 V 1.32 V 1.32 V
Minimum supply voltage 1.08 V 1.08 V 1.08 V 1.08 V
Nominal supply voltage 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 9 mm 9 mm 9 mm 9 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
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