TM4C123GH6ZRBT7R datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> TM4C123GH6ZRBT7R

TM4C123GH6ZRBT7R: DescriptionHigh performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 105; CategoryThe embedded processor and controller Microcontrollers and processors; File Size8MB，1471 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TM4C123GH6ZRBT7R Overview

High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 105

TM4C123GH6ZRBT7R Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	157
Reach Compliance Code	compli
Factory Lead Time	6 weeks
Has ADC	YES
Address bus width
bit size	32
boundary scan	YES
CPU series	CORTEX-M4F
maximum clock frequency	25 MHz
DAC channel	NO
DMA channel	YES
External data bus width
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B157
JESD-609 code	e1
length	9 mm
low power mode	YES
Humidity sensitivity level	3
Number of DMA channels	32
Number of external interrupt devices
Number of I/O lines	120
Number of serial I/Os	21
Number of terminals	157
Number of timers	12
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
RAM (bytes)	32768
RAM (number of words)	32
rom(word)	262144
ROM programmability	FLASH
Maximum seat height	1 mm
speed	80 MHz
Maximum slew rate	58.7 mA
Maximum supply voltage	1.32 V
Minimum supply voltage	1.08 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.65 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

TM4C123GH6ZRBT7R Related Products

	TM4C123GH6ZRBT7R	TM4C123GH6ZRBI7	TM4C123GH6ZRBT7	TM4C123GH6ZRBI7R
Description	High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 105	High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 85	High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 105	High performance 32-bit ARM® Cortex®-M4F based MCU 157-BGA MICROSTAR JUNIOR -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	VFBGA,	VFBGA,	VFBGA,	VFBGA,
Contacts	157	157	157	157
Reach Compliance Code	compli	compli	compli	compli
Factory Lead Time	6 weeks	6 weeks	6 weeks	6 weeks
Has ADC	YES	YES	YES	YES
bit size	32	32	32	32
boundary scan	YES	YES	YES	YES
CPU series	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F
maximum clock frequency	25 MHz	25 MHz	25 MHz	25 MHz
DAC channel	NO	NO	NO	NO
DMA channel	YES	YES	YES	YES
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES
JESD-30 code	S-PBGA-B157	S-PBGA-B157	S-PBGA-B157	S-PBGA-B157
JESD-609 code	e1	e1	e1	e1
length	9 mm	9 mm	9 mm	9 mm
low power mode	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3
Number of DMA channels	32	32	32	32
Number of I/O lines	120	120	120	120
Number of serial I/Os	21	21	21	21
Number of terminals	157	157	157	157
Number of timers	12	12	12	12
On-chip data RAM width	8	8	8	8
On-chip program ROM width	8	8	8	8
Maximum operating temperature	105 °C	85 °C	105 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	VFBGA	VFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260
RAM (bytes)	32768	32768	32768	32768
RAM (number of words)	32	32	32	32
rom(word)	262144	262144	262144	262144
ROM programmability	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1 mm	1 mm	1 mm	1 mm
speed	80 MHz	80 MHz	80 MHz	80 MHz
Maximum slew rate	58.7 mA	58.7 mA	58.7 mA	54.9 mA
Maximum supply voltage	1.32 V	1.32 V	1.32 V	1.32 V
Minimum supply voltage	1.08 V	1.08 V	1.08 V	1.08 V
Nominal supply voltage	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	9 mm	9 mm	9 mm	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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