OPA2340TDF1 datasheet, PDF - EEWORLD Datasheet

OPA2340TDF1: DescriptionSingle-Supply, Rail-to-Rail Operational Amplifier MicroAmplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size84KB，5 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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Single-Supply, Rail-to-Rail Operational Amplifier MicroAmplifier

Parameter Name	Attribute value
Brand Name	Texas Instruments
Maker	Texas Instruments
package instruction	DIE,
Reach Compliance Code	_compli
ECCN code	EAR99
Factory Lead Time	6 weeks
Amplifier type	OPERATIONAL AMPLIFIER
Maximum average bias current (IIB)	0.00001 µA
Minimum Common Mode Rejection Ratio	80 dB
Nominal Common Mode Rejection Ratio	92 dB
Maximum input offset voltage	500 µV
JESD-30 code	R-XUUC-N10
length	1.4436 mm
Number of functions	2
Number of terminals	10
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
method of packing	TUBE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Nominal slew rate	6 V/us
Maximum slew rate	1.9 mA
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	5500 kHz
width	1.4337 mm

	OPA2340TDF1	OPA2340TDF2
Description	Single-Supply, Rail-to-Rail Operational Amplifier MicroAmplifier	Single-Supply, Rail-to-Rail Operational Amplifier MicroAmplifier
Brand Name	Texas Instruments	Texas Instruments
Maker	Texas Instruments	Texas Instruments
package instruction	DIE,	DIE,
Reach Compliance Code	_compli	_compli
ECCN code	EAR99	EAR99
Factory Lead Time	6 weeks	16 weeks
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Maximum average bias current (IIB)	0.00001 µA	0.00001 µA
Minimum Common Mode Rejection Ratio	80 dB	80 dB
Nominal Common Mode Rejection Ratio	92 dB	92 dB
Maximum input offset voltage	500 µV	500 µV
JESD-30 code	R-XUUC-N10	R-XUUC-N10
length	1.4436 mm	1.4436 mm
Number of functions	2	2
Number of terminals	10	10
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	DIE
Package shape	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	UNCASED CHIP
method of packing	TUBE	TUBE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Nominal slew rate	6 V/us	6 V/us
Maximum slew rate	1.9 mA	1.9 mA
surface mount	YES	YES
technology	CMOS	CMOS
Terminal form	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	5500 kHz	5500 kHz
width	1.4337 mm	1.4337 mm

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