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OPA2340TDF2

Description
Single-Supply, Rail-to-Rail Operational Amplifier MicroAmplifier™
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size84KB,5 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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OPA2340TDF2 Overview

Single-Supply, Rail-to-Rail Operational Amplifier MicroAmplifier™

OPA2340TDF2 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
MakerTexas Instruments
package instructionDIE,
Reach Compliance Code_compli
ECCN codeEAR99
Factory Lead Time16 weeks
Amplifier typeOPERATIONAL AMPLIFIER
Maximum average bias current (IIB)0.00001 µA
Minimum Common Mode Rejection Ratio80 dB
Nominal Common Mode Rejection Ratio92 dB
Maximum input offset voltage500 µV
JESD-30 codeR-XUUC-N10
length1.4436 mm
Number of functions2
Number of terminals10
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeRECTANGULAR
Package formUNCASED CHIP
method of packingTUBE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Nominal slew rate6 V/us
Maximum slew rate1.9 mA
surface mountYES
technologyCMOS
Terminal formNO LEAD
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
Nominal Uniform Gain Bandwidth5500 kHz
width1.4337 mm

OPA2340TDF2 Related Products

OPA2340TDF2 OPA2340TDF1
Description Single-Supply, Rail-to-Rail Operational Amplifier MicroAmplifier™ Single-Supply, Rail-to-Rail Operational Amplifier MicroAmplifier™
Brand Name Texas Instruments Texas Instruments
Maker Texas Instruments Texas Instruments
package instruction DIE, DIE,
Reach Compliance Code _compli _compli
ECCN code EAR99 EAR99
Factory Lead Time 16 weeks 6 weeks
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Maximum average bias current (IIB) 0.00001 µA 0.00001 µA
Minimum Common Mode Rejection Ratio 80 dB 80 dB
Nominal Common Mode Rejection Ratio 92 dB 92 dB
Maximum input offset voltage 500 µV 500 µV
JESD-30 code R-XUUC-N10 R-XUUC-N10
length 1.4436 mm 1.4436 mm
Number of functions 2 2
Number of terminals 10 10
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code DIE DIE
Package shape RECTANGULAR RECTANGULAR
Package form UNCASED CHIP UNCASED CHIP
method of packing TUBE TUBE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Nominal slew rate 6 V/us 6 V/us
Maximum slew rate 1.9 mA 1.9 mA
surface mount YES YES
technology CMOS CMOS
Terminal form NO LEAD NO LEAD
Terminal location UPPER UPPER
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
Nominal Uniform Gain Bandwidth 5500 kHz 5500 kHz
width 1.4337 mm 1.4337 mm
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