† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input-voltage ratings may be exceeded provided the input-current ratings are observed.
recommended operating conditions
MIN
VCC
VIH
VIL
IIK
IOH
IOL
TA
Supply voltage
High-level input voltage
Low-level input voltage
Input clamp current
High-level output current
Low-level output current
Operating free-air temperature
0
4.5
2
0.8
−18
−1
20
70
NOM
5
MAX
5.5
UNIT
V
V
V
mA
mA
mA
°C
2−2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
•
SDFS030B − D2932, MARCH 1987 − REVISED OCTOBER 1993
SN74F378
HEX D TYPE FLIP FLOP
WITH CLOCK ENABLE
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
VOL
II
IIH
IIL
IOS‡
ICC
VCC = 4.5 V,
VCC = 4.5 V,
VCC = 4.75 V,
VCC = 4.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
TEST CONDITIONS
II = − 18 mA
IOH = − 1 mA
IOH = − 1 mA
IOL = 20 mA
VI = 7 V
VI = 2.7 V
VI = 0.5 V
VO = 0
− 60
MIN
2.5
2.7
0.3
0.5
0.1
20
− 0.6
− 150
TYP†
3.4
V
V
mA
µA
mA
mA
MAX
− 1.2
UNIT
V
VCC = 5.5 V,
See Note 2
30
45
mA
† All typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
NOTE 2: ICC is measured with all outputs open, all data inputs and the enable input grounded, and the clock input at 4.5 V after being momentarily
grounded.
timing requirements
VCC = 5 V,
TA = 25°C
MIN
fclock
tw
Clock frequency
CLK high
Pulse duration
CLK low
Data high or low
tsu
Setup time before CLK↑
CLKEN high
CLKEN low
Data high or low
th
Hold time after CLK↑
CLKEN high or low
0
4
6
5
3.5
5
1
0
MAX
110
VCC = 4.5 V to 5.5 V,
TA = MIN to MAX§
MIN
0
4
6
5
3.5
5
1
0
ns
ns
ns
MAX
110
MHz
UNIT
switching characteristics (see Note 3)
FROM
(INPUT)
TO
(OUTPUT)
VCC = 5 V,
CL = 50 pF,
RL = 500
Ω,
TA = 25°C
MIN
fmax
tPLH
110
CLK
Any Q
3.3
TYP
125
4.5
6.1
MAX
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500
Ω,
TA = MIN to MAX§
MIN
110
3.1
6.7
6.1
MAX
MHz
ns
PARAMETER
UNIT
tPHL
3
4.2
6
2.9
§ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 3: Load circuits and waveforms are shown in Section 1.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
•
2−3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
SN74F378D
SN74F378DR
SN74F378N
(1)
Status
(1)
OBSOLETE
OBSOLETE
OBSOLETE
Package
Type
SOIC
SOIC
PDIP
Package
Drawing
D
D
N
Pins Package Eco Plan
(2)
Qty
16
16
16
TBD
TBD
TBD
Lead/Ball Finish
Call TI
Call TI
Call TI
MSL Peak Temp
(3)
Call TI
Call TI
Call TI
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
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