SG2626DW datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Analog mixed-signal IC> Drivers and interfaces> SG2626DW

SG2626DW: DescriptionBuffer/Inverter Based MOSFET Driver, 3A, BIPolar, PDSO16, PLASTIC, SOIC-16; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size148KB，8 Pages; ManufacturerLinfinity Microelectronics

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SG2626DW Overview

Buffer/Inverter Based MOSFET Driver, 3A, BIPolar, PDSO16, PLASTIC, SOIC-16

SG2626DW Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Linfinity Microelectronics
package instruction	PLASTIC, SOIC-16
Reach Compliance Code	unknown
high side driver	NO
Input properties	STANDARD
Interface integrated circuit type	BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 code	R-PDSO-G16
JESD-609 code	e0
Number of functions	2
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
Output characteristics	TOTEM-POLE
Nominal output peak current	3 A
Output polarity	INVERTED
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP20,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	4.5/20 V
Certification status	Not Qualified
Maximum slew rate	35 mA
Maximum supply voltage	20 V
Minimum supply voltage	4.5 V
Nominal supply voltage	15 V
surface mount	YES
technology	BIPOLAR
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Disconnect time	0.025 µs
connection time	0.035 µs

SG2626DW Preview

SG1626/SG2626/SG3626

DUAL HIGH SPEED DRIVER

DESCRIPTION

The SG1626, 2626, 3626 is a dual inverting monolithic high

speed driver that is pin for pin compatible with the DS0026,

TSC426 and ICL7667. This device utilizes high voltage Schottky

logic to convert TTL signals to high speed outputs up to 18V. The

totem pole outputs have 3A peak current capability, which en-

ables them to drive 1000pF loads in typically less than 25ns.

These speeds make it ideal for driving power MOSFETs and

other large capacitive loads requiring high speed switching.

In addition to the standard packages, Silicon General offers the

16 pin S.O.I.C. (DW-package) for commercial and industrial

applications, and the Hermetic TO-66 (R-package) for military

use. These packages offer improved thermal performance for

applications requiring high frequencies and/or high peak cur-

rents.

FEATURES

•

Pin for pin compatible with DS0026, TSC426 and

ICL7667.

•

Totem pole outputs with 3.0A peak current capability.

•

Supply voltage to 22V.

•

Rise and fall times less than 25ns.

•

Propagation delays less than 20ns.

•

Inverting high-speed high-voltage Schottky logic.

•

Efficient operation at high frequency.

•

Available in:

8 Pin Plastic and Ceramic DIP

14 Pin Ceramic DIP

16 Pin Plastic S.O.I.C.

20 Pin LCC

TO-99

TO-66

HIGH RELIABILITY FEATURES - SG1626

♦

Available to MIL-STD-883

♦

Radiation data available

♦

LMI level"S" processing available

EQUIVALENT CIRCUIT SCHEMATIC

6.5V

REG

2.5K

INV. INPUT

OUTPUT

GND

9/91 Rev 1.1 2/94

1994

11861 Western Avenue

∞

Garden Grove, CA 92841

(714) 898-8121

∞

FAX: (714) 893-2570

INFINITY

Microelectronics Inc.

SG1626/SG2626/SG3626

ABSOLUTE MAXIMUM RATINGS

(Note 1)

Supply Voltage (V

) ........................................................... 22V

Logic Input Voltage ............................................................... 7V

Source/Sink Output Current (Each Output)

Continuous ...................................................................

±0.5A

Pulse, 500ns ................................................................

±3.0A

Operating Junction Temperature

Hermetic (J, T, Y, R-Packages) ................................... 150°C

Plastic (M, DW, L-Packages) ....................................... 150°C

Storage Temperature Range ............................ -65°C to 150°C

Lead Temperature (Soldering, 10 Seconds) ................... 300°C

Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to ground. All currents are positive into the

specified terminal.

THERMAL DATA

J Package:

Thermal Resistance-

Junction to Case

.................. 30°C/W

Thermal Resistance-

Junction to Ambient

.............. 80°C/W

Y Package:

Thermal Resistance-

Junction to Case

.................. 50°C/W

Thermal Resistance-

Junction to Ambient

............ 130°C/W

M Package:

Thermal Resistance-

Junction to Case

.................. 60°C/W

Thermal Resistance-

Junction to Ambient

............. 95°C/W

DW Package:

Thermal Resistance-

Junction to Case

.................. 40°C/W

Thermal Resistance-

Junction to Ambient

.............. 95°C/W

T Package:

Thermal Resistance-

Junction to Case

.................. 25°C/W

Thermal Resistance-

Junction to Ambient

........... 130°C/W

R Package:

Thermal Resistance-

Junction to Case

................. 5.0°C/W

Thermal Resistance-

Junction to Ambient

............. 40°C/W

L Package:

Thermal Resistance-

Junction to Case

.................. 35°C/W

Thermal Resistance-

Junction to Ambient

........... 120°C/W

Note A. Junction Temperature Calculation: T

= T

+ (P

Note B. The above numbers for

are maximums for the limiting

thermal resistance of the package in a standard mount-

ing configuration. The

numbers are meant to be

guidelines for the thermal performance of the device/pc-

board system. All of the above assume no ambient

airflow.

RECOMMENDED OPERATING CONDITIONS

(Note 2)

Supply Voltage (V

) .................................. 4.5V to 20V

(Note 3)

Frequency Range ............................................... DC to 1.5MHz

Peak Pulse Current ............................................................

±3A

Logic Input Voltage ................................................ -0.5 to 5.5V

Note 2. Range over which the device is functional.

Note 3. AC performance has been optimized for V

= 8V to 20V.

Operating Ambient Temperature Range (T

)

SG1626 ......................................................... -55°C to 125°C

SG2626 ........................................................... -25°C to 85°C

SG3626 .............................................................. 0°C to 70°C

ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1626 with -55°C

≤

125°C, SG2626 with -

25°C

≤

85°C, SG3626 with 0°C

≤

70°C, and V

= 20V. Low duty cycle pulse testing techniques are used which maintains junction and case

temperatures equal to the ambient temperature.)

Parameter

Static Characteristics

Logic 1 Input Voltage

Logic 0 Input Voltage

Input High Current

Input Low Current

Input Clamp Voltage

Output High Voltage

(Note 4)

Output Low Voltage

(Note 4)

Supply Current Outputs Low

Supply Current Outputs High

Note 4. V

= 10V to 20V.

Test Conditions

SG1626/2626/3626

Units

Min. Typ. Max.

2.0

µA

= 2.4V

= 5.5V

= 0V

= -10mA

OUT

= -200mA

OUT

= 200mA

= 2.4V (both inputs)

= 0V (both inputs)

0.7

500

1.0

-4

-1.5

-3

7.5

1.0

9/91 Rev 1.1 2/94

1994

11861 Western Avenue

∞

Garden Grove, CA 92841

(714) 898-8121

∞

FAX: (714) 893-2570

INFINITY

Microelectronics Inc.

SG1626/SG2626/SG3626

ELECTRICAL CHARACTERISTICS

Parameter

Dynamic Characteristics

(Note 6)

Propagation Delay High-Low

(TPHL)

Propagation Delay Low-High

(TPLH)

Rise Time (TTLH)

Fall Time (TTHL)

Supply Current (I

)

(both outputs)

(continued)

SG1626/2626/3626

Test Conditions

(Figure 1)

= 25°C

=-55°C to 125°C

SG1626

Units

Min. Typ. Max. Min. Typ. Max.

= 1000pF

(Note 5)

= 2500pF

= 1000pF

(Note 5)

= 2500pF

= 1000pF

(Note 5)

= 2500pF

= 1000pF

(Note 5)

= 2500pF

= 2500pF, Freq. = 200KHz

Duty Cycle = 50%

Note 5. These parameters, specified at 1000pF, although guaranteed over recommended operating conditions, are not 100% tested in produc-

tion.

Note 6. V

= 15V.

AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS - FIGURE 1

SG1626

CHARACTERISTIC CURVES

FIGURE 2.

TRANSITION TIMES VS. SUPPLY VOLTAGE

FIGURE 3.

PROPAGATION DELAY VS. SUPPLY VOLTAGE

FIGURE 4.

TRANSITION TIMES VS. AMBIENT TEMPERATURE

9/91 Rev 1.1 2/94

1994

11861 Western Avenue

∞

Garden Grove, CA 92841

(714) 898-8121

∞

FAX: (714) 893-2570

INFINITY

Microelectronics Inc.

SG1626/SG2626/SG3626

CHARACTERISTIC CURVES

(continued)

FIGURE 5.

PROPAGATION DELAY VS. AMBIENT TEMPERATURE

FIGURE 6.

TRANSITION TIMES VS. CAPACITIVE LOAD

FIGURE 7.

SUPPLY CURRENT VS. CAPACITANCE LOAD

FIGURE 8.

HIGH SIDE SATURATION VS. OUTPUT CURRENT

FIGURE 9.

LOW SIDE SATURATION VS. OUTPUT CURRENT

FIGURE 10.

SUPPLY CURRENT VS. FREQUENCY

FIGURE 11.

SUPPLY CURRENT VS. FREQUENCY

9/91 Rev 1.1 2/94

1994

11861 Western Avenue

∞

Garden Grove, CA 92841

(714) 898-8121

∞

FAX: (714) 893-2570

INFINITY

Microelectronics Inc.

SG1626/SG2626/SG3626

APPLICATION INFORMATION

POWER DISSIPATION

The SG1626, while more energy-efficient than earlier gold-doped

driver IC’s, can still dissipate considerable power because of its

high peak current capability at high frequencies. Total power

dissipation in any specific application will be the sum of the DC or

steady-state power dissipation, and the AC dissipation caused by

driving capacitive loads.

The DC power dissipation is given by:

= +V

· I

[1]

where I

is a function of the driver state, and hence is duty-cycle

dependent.

The AC power dissipation is proportional to the switching fre-

quency, the load capacitance, and the square of the output

voltage. In most applications, the driver is constantly changing

state, and the AC contribution becomes dominant when the

frequency exceeds 100-200KHz.

The SG1626 driver family is available in a variety of packages to

accommodate a wide range of operating temperatures and

power dissipation requirements. The Absolute Maximums sec-

tion of the data sheet includes two graphs to aid the designer in

choosing an appropriate package for his design.

The designer should first determine the actual power dissipation

of the driver by referring to the curves in the data sheet relating

operating current to supply voltage, switching frequency, and

capacitive load. These curves were generated from data taken

on actual devices. The designer can then refer to the Absolute

Maximum Thermal Dissipation curves to choose a package type,

and to determine if heat-sinking is required.

DESIGN EXAMPLE

Given: Two 2500 pF loads must be driven push-pull from a +15

volt supply at 100KHz. This is a commercial application where

the maximum ambient temperature is +50°C, and cost is impor-

tant.

1. From Figure 11, the average driver current consumption

under these conditions will be 18mA, and the power dissipation

will be 15volts x 18mA, or 270mW.

2. From the Ambient Thermal Characteristic curve, it can be

seen that the M package, which is an 8-pin plastic DIP with a

copper lead frame, has more than enough thermal conductance

from junction to ambient to support operation at an ambient

temperature of +50°C. The SG3626M driver would be specified

for this application.

SUPPLY BYPASSING

Since the SG1626 can deliver peak currents above 3amps under

some load conditions, adequate supply bypassing is essential for

proper operation. Two capacitors in parallel are recommended

to guarantee low supply impedance over a wide bandwidth: a

0.1µF ceramic disk capacitor for high frequencies, and a 4.7µF

solid tantalum capacitor for energy storage. In military applica-

9/91 Rev 1.1 2/94

1994

tions, a CK05 or CK06 ceramic operator with a CSR-13 tantalum

capacitor is an effective combination. For commercial applica-

tions, any low-inductance ceramic disk capacitor teamed with a

Sprague 150D or equivalent low ESR capacitor will work well.

The capacitors must be located as close as physically possible to

the V

pin, with combined lead and pc board trace lengths held

to less than 0.5 inches.

GROUNDING CONSIDERATIONS

Since ground is both the reference potential for the driver logic

and the return path for the high peak output currents of the driver,

use of a low-inductance ground system is essential. A ground

plane is highly recommended for best performance. In dense,

high performance applications a 4-layer pc board works best; the

2 inner planes are dedicated to power and ground distribution,

and signal traces are carried by the outside layers. For cost-

sensitive designs a 2-layer board can be made to work, with one

layer dedicated completely to ground, and the other to power and

signal distribution. A great deal of attention to component layout

and interconnect routing is required for this approach.

LOGIC INTERFACE

The logic input of the 1626 is designed to accept standard DC-

coupled 5 volt logic swings, with no speed-up capacitors re-

quired. If the input signal voltage exceeds 6 volts, the input pin

must be protected against the excessive voltage in the HIGH

state. Either a high speed blocking diode must be used, or a

resistive divider to attenuate the logic swing is necessary.

LAYOUT FOR HIGH SPEED

The SG1626 can generate relatively large voltage excursions

with rise and fall times around 20-30 nanoseconds with light

capacitive loads. A Fourier analysis of these time domain signals

will indicate strong energy components at frequencies much

higher than the basic switching frequency. These high frequen-

cies can induce ringing on an otherwise ideal pulse if sufficient

inductance occurs in the signal path (either the positive signal

trace or the ground return). Overshoot on the rising edge is

undesirable because the excess drive voltage could rupture the

gate oxide of a power MOSFET. Trailing edge undershoot is

dangerous because the negative voltage excursion can forward-

bias the parasitic PN substrate diode of the driver, potentially

causing erratic operation or outright failure.

Ringing can be reduced or eliminated by minimizing signal path

inductance, and by using a damping resistor between the drive

output and the capacitive load. Inductance can be reduced by

keeping trace lengths short, trace widths wide, and by using 2oz.

copper if possible. The resistor value for critical damping can be

calculated from:

= 2√L/C

[2]

where L is the total signal line inductance, and C

is the load

capacitance. Values between 10 and 100ohms are usually

sufficient. Inexpensive carbon composition resistors are best

because they have excellent high frequency characteristics.

They should be located as close as possible to the gate terminal

of the power MOSFET.

11861 Western Avenue

∞

Garden Grove, CA 92841

(714) 898-8121

∞

FAX: (714) 893-2570

INFINITY

Microelectronics Inc.

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