|
LM3S2965-IBZ50-A2 |
LM3S2965-IQC50-A2 |
LM3S2965-IBZ50-A2T |
LM3S2965-EQC50-A2 |
LM3S2965-EQC50-A2T |
LM3S2965-IQC50-A2T |
| Description |
Stellaris LM3S Microcontroller 108-NFBGA -40 to 85 |
Stellaris LM3S Microcontroller 100-LQFP -40 to 85 |
Stellaris LM3S Microcontroller 108-NFBGA -40 to 85 |
Stellaris LM3S Microcontroller 100-LQFP -40 to 105 |
Stellaris LM3S Microcontroller 100-LQFP -40 to 105 |
Stellaris LM3S Microcontroller 100-LQFP -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
BGA |
QFP |
BGA |
QFP |
QFP |
QFP |
| package instruction |
BGA-108 |
LFQFP, QFP100,.63SQ,20 |
GREEN, MO-219F, BGA-108 |
LQFP-100 |
GREEN, MS-026BED, LQFP-100 |
LFQFP, QFP100,.63SQ,20 |
| Contacts |
108 |
100 |
108 |
100 |
100 |
100 |
| Reach Compliance Code |
compliant |
compli |
compliant |
compliant |
compliant |
compliant |
| ECCN code |
3A001.A.3 |
3A991.A.2 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A991.A.2 |
| Factory Lead Time |
16 weeks |
6 weeks |
16 weeks |
16 weeks |
19 weeks |
16 weeks |
| Has ADC |
YES |
YES |
YES |
YES |
YES |
YES |
| Other features |
ALSO REQUIRES 3.3 V IO SUPPLY |
ALSO REQUIRES 3.3 V IO SUPPLY |
ALSO REQUIRES 3.3 V IO SUPPLY |
ALSO REQUIRES 3.3 V IO SUPPLY |
ALSO REQUIRES 3.3 V IO SUPPLY |
ALSO REQUIRES 3.3 V IO SUPPLY |
| bit size |
32 |
32 |
32 |
32 |
32 |
32 |
| maximum clock frequency |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
| DAC channel |
NO |
NO |
NO |
NO |
NO |
NO |
| DMA channel |
NO |
NO |
NO |
NO |
NO |
NO |
| JESD-30 code |
S-PBGA-B108 |
S-PQFP-G100 |
S-PBGA-B108 |
S-PQFP-G100 |
S-PQFP-G100 |
S-PQFP-G100 |
| JESD-609 code |
e1 |
e3 |
e1 |
e3 |
e3 |
e3 |
| length |
10 mm |
14 mm |
10 mm |
14 mm |
14 mm |
14 mm |
| Humidity sensitivity level |
3 |
3 |
3 |
3 |
3 |
3 |
| Number of I/O lines |
56 |
56 |
56 |
56 |
56 |
56 |
| Number of terminals |
108 |
100 |
108 |
100 |
100 |
100 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
105 °C |
105 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| PWM channel |
YES |
YES |
YES |
YES |
YES |
YES |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LFBGA |
LFQFP |
LFBGA |
LFQFP |
LFQFP |
LFQFP |
| Encapsulate equivalent code |
BGA108,12X12,32 |
QFP100,.63SQ,20 |
BGA108,12X12,32 |
QFP100,.63SQ,20 |
QFP100,.63SQ,20 |
QFP100,.63SQ,20 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
| power supply |
2.5,3.3 V |
2.5,3.3 V |
2.5,3.3 V |
2.5,3.3 V |
2.5,3.3 V |
2.5,3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| RAM (bytes) |
65536 |
65536 |
65536 |
65536 |
65536 |
65536 |
| rom(word) |
262144 |
262144 |
262144 |
262144 |
262144 |
262144 |
| ROM programmability |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
| Maximum seat height |
1.5 mm |
1.6 mm |
1.5 mm |
1.6 mm |
1.6 mm |
1.6 mm |
| speed |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
| Maximum supply voltage |
2.75 V |
2.75 V |
2.75 V |
2.75 V |
2.75 V |
2.75 V |
| Minimum supply voltage |
2.25 V |
2.25 V |
2.25 V |
2.25 V |
2.25 V |
2.25 V |
| Nominal supply voltage |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Matte Tin (Sn) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Matte Tin (Sn) |
TIN |
Matte Tin (Sn) |
| Terminal form |
BALL |
GULL WING |
BALL |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.8 mm |
0.5 mm |
0.8 mm |
0.5 mm |
0.5 mm |
0.5 mm |
| Terminal location |
BOTTOM |
QUAD |
BOTTOM |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
10 mm |
14 mm |
10 mm |
14 mm |
14 mm |
14 mm |
| uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
| Is it lead-free? |
Lead free |
Lead free |
- |
Lead free |
- |
Lead free |
| boundary scan |
YES |
YES |
- |
YES |
- |
YES |
| CPU series |
CORTEX-M3 |
CORTEX-M3 |
- |
CORTEX-M3 |
- |
CORTEX-M3 |
| Format |
FIXED POINT |
FIXED POINT |
- |
FIXED POINT |
- |
FIXED POINT |
| Integrated cache |
YES |
YES |
- |
YES |
- |
YES |
| low power mode |
YES |
YES |
- |
YES |
- |
YES |
| Number of serial I/Os |
9 |
9 |
- |
8 |
- |
9 |
| Number of timers |
4 |
4 |
- |
4 |
- |
4 |
| On-chip data RAM width |
8 |
8 |
- |
8 |
- |
8 |
| On-chip program ROM width |
8 |
8 |
- |
8 |
- |
8 |
| Base Number Matches |
1 |
- |
1 |
1 |
1 |
- |