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PUMA68FV32006X-90

Description
Flash Module, 1MX32, 90ns, PQMA68, PLASTIC, LCC-68
Categorystorage    storage   
File Size128KB,5 Pages
ManufacturerMOSAIC
Websitehttp://www.mosaicsemi.com/
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PUMA68FV32006X-90 Overview

Flash Module, 1MX32, 90ns, PQMA68, PLASTIC, LCC-68

PUMA68FV32006X-90 Parametric

Parameter NameAttribute value
MakerMOSAIC
Parts packaging codeQMA
package instructionPLASTIC, LCC-68
Contacts68
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time90 ns
Other featuresCAN ALSO BE CONFIGURED AS 4M X 8
Spare memory width16
JESD-30 codeS-PQMA-J68
memory density33554432 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals68
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
organize1MX32
Package body materialPLASTIC/EPOXY
Package shapeSQUARE
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Programming voltage3.3 V
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)2.97 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Terminal formJ BEND
Terminal locationQUAD
typeNOR TYPE

PUMA68FV32006X-90 Preview

1M x 32 FLASH Module
PUMA68FV32006X - 90/12/15
Issue 5.0 January 2000
Description
The PUMA68 range of devices provide a high
density surface mount industry standard memory
solution which may accommodate various memory
technologies including SRAM, EEPROM and
Flash. The devices are designed to offer a defined
upgrade path and may be user configured as 8, 16
or 32 bits wide.
The PUMA68FV32006X is a 1Mx32 FLASH module
housed in a 68 J leaded package which complies with
the JEDEC 68 PLCC standard. Access times of 90,
120 or 150ns are available. The 3.3V device is
available to commercial and industrial temperature
grade.
2M x 32 FLASH PUMA68 devices are available in the
same footprint to offer a defined upgrade path.
Block Diagram
A0~A19
/OE
/WE
1M x 8
FLASH
/CS1
/CS2
/CS3
/CS4
D0~7
D8~15
D16~23
D24~31
1M x 8
FLASH
1M x 8
FLASH
1M x 8
FLASH
Features
• Access times of 90, 120 and 150ns.
• 3.3V + 10%.
• Commercial and Industrial temperature grades
• JEDEC Standard 68 PLCC footprint.
• Industry standard pinout.
• May be organised as 1Mx32, 2Mx16 or 4Mx8
• User configurable as 8 / 16 / 32 bits wide.
• 10 Year Data Retention
• Write Erase Cycle Endurance 100,000 (min)
• Automatic Write/Erase by Embedded Algorithm
• Uniform Sector Device.
Pin Definition
See page 2.
Pin Functions
Description
Address Input
Data Input/Output
Chip Select
Write Enable
Output Enable
No Connect
Power
Ground
Signal
A0~A19
D0~D31
/CS1~4
/WE
/OE
NC
V
CC
V
SS
Package Details
Plastic ‘J’ Leaded JEDEC PLCC
Max. Dimensions (mm) - 25.27 x 25.27 x 5.08
11403 West Bernardo Court, Suite 100, San Diego, CA92127.
TEL (001) 858 674 2233, Fax No. (001) 858 674 2230 E-mail:
sales@mosaicsemi.com
Pin Definition - PUMA68FV32006X
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
Signal
V
CC
A19
/CS1
/CS2
/CS3
/CS4
A17
A18
D16
D17
D18
D19
V
SS
D20
D21
D22
D23
V
CC
D24
D25
D26
D27
V
SS
D28
D29
D30
D31
A6
A5
A4
A3
A2
A1
A0
Pin
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
Signal
V
CC
A13
A12
A11
A10
A9
A8
A7
D0
D1
D2
D3
V
SS
D4
D5
D6
D7
V
CC
D8
D9
D10
D11
V
SS
D12
D13
D14
D15
A14
A15
A16
/WE
/OE
NC
NC
PAGE 2
Issue 5.0 January 2000
Package Details
PUMA 68 pin JEDEC Surface Mounted PLCC
Pin 1
Pin 68
25.27 (0.995)
25.02 (0.985)
5.08
(0.200)
max
0.46 typ.
(0.018)
1.27 typ.
(0.050)
0.90
(0.035)
typ
24.13 (0.950)
23.11 (0.910)
PAGE 3
Issue 5.0 January 2000
Ordering Information
Ordering Information
PUMA 68FV32006XI - 90
Speed
90 = 90ns
12 = 120ns
15 = 150ns
Blank = Commercial
I = Industrial
X = Industry Standard
Pinout
32006 = configurable as
1M x 32, 2M x 16 or
4M x 8
FV = FLASH, 3.3V + 10% V
CC
PUMA 68 = 68 pin ‘J’ Leaded PLCC
Temp. Range/Screening
Pinout Configuration
Memory Organisation
Technology
Package
Note :
Although this data is believed to be accurate the information contained herein is not intended to and does not create
any warranty of merchantibility or fitness for a particular purpose.
Our products are subject to a constant process of development. Data may be changed without notice.
Products are not authorised for use as critical components in life support devices without the express written
approval of a company director.
PAGE 4
http://www.mosaicsemi.com/
Issue 5.0 January 2000
Customer Guidelines
Co Planarity
Specified as +/- 2 thou max.
Visual Inspection Standard
All devices inspected to ANSI/J-STD-001B Class 2 standard
Moisture Sensitivity
Devices are
moisture sensitive.
Shelf Life in Sealed Bag 12 months at <40
O
C and <90% relative humidity (RH).
After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or
equivalent processing (peak package body temp 220
O
C)
must be
:
A : Mounted within 72 Hours at factory conditions of <30
O
C/60% RH
OR
B : Stored at <20% RH
If these conditions are not met or indicator card is >20% when read at 23
O
C +/-5% devices
require baking
as specified below.
If baking is required, devices may be baked for :-
A : 24 hours at 125
O
C +/-5% for high temperature device containers
OR
B : 192 hours at 40
O
C +5
O
C/-0
O
C and <5% RH for low temperature device containers.
Packaging Standard
Devices packaged in dry nitrogen, JED-STD-020.
Packaged in trays as standard.
Tape and reel available for shipment quantities exceeding 200pcs upon request.
Soldering Recomendations
IR/Convection -
Ramp Rate
Temp. exceeding 183
O
C
Peak Temperature
Time within 5
O
C of peak
Ramp down
Ramp up rate
Peak Temperature
Time within 5
O
C of peak
Ramp down
6
O
C/sec max.
150 secs. max.
225
O
C
20 secs max.
6
O
C/sec max.
6
O
C/sec max.
215 - 219
O
C
60 secs max.
6
O
C/sec max.
Vapour Phase -
The above conditions must not be exceeded.
Note : The above recommendations are based on standard industry practice. Failure to comply with
the above recommendations invalidates product warranty.
PAGE 5
Issue 5.0 January 2000

PUMA68FV32006X-90 Related Products

PUMA68FV32006X-90 PUMA68FV32006X-12
Description Flash Module, 1MX32, 90ns, PQMA68, PLASTIC, LCC-68 Flash Module, 1MX32, 120ns, PQMA68, PLASTIC, LCC-68
Maker MOSAIC MOSAIC
Parts packaging code QMA QMA
package instruction PLASTIC, LCC-68 PLASTIC, LCC-68
Contacts 68 68
Reach Compliance Code unknown unknown
ECCN code 3A991.B.1.A 3A991.B.1.A
Maximum access time 90 ns 120 ns
Other features CAN ALSO BE CONFIGURED AS 4M X 8 CAN ALSO BE CONFIGURED AS 4M X 8
Spare memory width 16 16
JESD-30 code S-PQMA-J68 S-PQMA-J68
memory density 33554432 bit 33554432 bit
Memory IC Type FLASH MODULE FLASH MODULE
memory width 32 32
Number of functions 1 1
Number of terminals 68 68
word count 1048576 words 1048576 words
character code 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
organize 1MX32 1MX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape SQUARE SQUARE
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Programming voltage 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
Maximum supply voltage (Vsup) 3.63 V 3.63 V
Minimum supply voltage (Vsup) 2.97 V 2.97 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Terminal form J BEND J BEND
Terminal location QUAD QUAD
type NOR TYPE NOR TYPE
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