|
TPS22915BYFPT |
TPS22914BYFPR |
TPS22914BYFPT |
TPS22914CYFPT |
TPS22915CYFPR |
TPS22915CYFPT |
| Description |
5.5V, 2A, 38mΩ Load Switch With Quick Output Discharge 4-DSBGA -40 to 105 |
5.5V, 2A, 38mΩ Load Switch 4-DSBGA -40 to 105 |
5.5V, 2A, 38mΩ Load Switch 4-DSBGA -40 to 105 |
5.5V, 2A, 38mΩ Load Switch 4-DSBGA -40 to 105 |
5.5V, 2A, 38mΩ Load Switch With Quick Output Discharge 4-DSBGA -40 to 105 |
5.5V, 2A, 38mΩ Load Switch With Quick Output Discharge 4-DSBGA -40 to 105 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
| package instruction |
VFBGA, |
VFBGA, |
VFBGA, |
VFBGA, |
VFBGA, |
VFBGA, |
| Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
compli |
| Factory Lead Time |
6 weeks |
8 weeks |
6 weeks |
6 weeks |
16 weeks |
12 weeks |
| Built-in protection |
TRANSIENT |
TRANSIENT |
TRANSIENT |
TRANSIENT |
TRANSIENT |
TRANSIENT |
| Interface integrated circuit type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 code |
S-XBGA-B4 |
S-XBGA-B4 |
S-XBGA-B4 |
S-XBGA-B4 |
S-XBGA-B4 |
S-XBGA-B4 |
| JESD-609 code |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
| length |
0.748 mm |
0.748 mm |
0.748 mm |
0.748 mm |
0.748 mm |
0.748 mm |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
4 |
4 |
4 |
4 |
4 |
4 |
| Maximum operating temperature |
105 °C |
85 °C |
85 °C |
85 °C |
105 °C |
105 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Output current flow direction |
SINK |
SINK |
SINK |
SINK |
SINK |
SINK |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
| Maximum seat height |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
| Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage |
1.05 V |
1.05 V |
1.05 V |
1.05 V |
1.05 V |
1.05 V |
| Nominal supply voltage |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
| Terminal pitch |
0.4 mm |
0.4 mm |
0.4 mm |
0.4 mm |
0.4 mm |
0.4 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
0.748 mm |
0.748 mm |
0.748 mm |
0.748 mm |
0.748 mm |
0.748 mm |