TPS22914BYFPR datasheet, PDF - EEWORLD Datasheet

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TPS22914BYFPR: Description5.5V, 2A, 38mΩ Load Switch 4-DSBGA -40 to 105; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size1MB，30 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TPS22914BYFPR Overview

5.5V, 2A, 38mΩ Load Switch 4-DSBGA -40 to 105

TPS22914BYFPR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	VFBGA,
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	8 weeks
Built-in protection	TRANSIENT
Interface integrated circuit type	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 code	S-XBGA-B4
JESD-609 code	e1
length	0.748 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	4
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output current flow direction	SINK
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Maximum seat height	0.5 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	1.05 V
Nominal supply voltage	1.2 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.4 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.748 mm
Base Number Matches	1

TPS22914BYFPR Related Products

	TPS22914BYFPR	TPS22915BYFPT	TPS22914BYFPT	TPS22914CYFPT	TPS22915CYFPR	TPS22915CYFPT
Description	5.5V, 2A, 38mΩ Load Switch 4-DSBGA -40 to 105	5.5V, 2A, 38mΩ Load Switch With Quick Output Discharge 4-DSBGA -40 to 105	5.5V, 2A, 38mΩ Load Switch 4-DSBGA -40 to 105	5.5V, 2A, 38mΩ Load Switch 4-DSBGA -40 to 105	5.5V, 2A, 38mΩ Load Switch With Quick Output Discharge 4-DSBGA -40 to 105	5.5V, 2A, 38mΩ Load Switch With Quick Output Discharge 4-DSBGA -40 to 105
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
package instruction	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,
Reach Compliance Code	compli	compli	compli	compli	compli	compli
Factory Lead Time	8 weeks	6 weeks	6 weeks	6 weeks	16 weeks	12 weeks
Built-in protection	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT
Interface integrated circuit type	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 code	S-XBGA-B4	S-XBGA-B4	S-XBGA-B4	S-XBGA-B4	S-XBGA-B4	S-XBGA-B4
JESD-609 code	e1	e1	e1	e1	e1	e1
length	0.748 mm	0.748 mm	0.748 mm	0.748 mm	0.748 mm	0.748 mm
Humidity sensitivity level	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1
Number of terminals	4	4	4	4	4	4
Maximum operating temperature	85 °C	105 °C	85 °C	85 °C	105 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output current flow direction	SINK	SINK	SINK	SINK	SINK	SINK
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
Maximum seat height	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	1.05 V	1.05 V	1.05 V	1.05 V	1.05 V	1.05 V
Nominal supply voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.4 mm	0.4 mm	0.4 mm	0.4 mm	0.4 mm	0.4 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	0.748 mm	0.748 mm	0.748 mm	0.748 mm	0.748 mm	0.748 mm

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