ECCM9CA12-26.000M TR
Series
RoHS Compliant (Pb-free) 3.2mm x 5mm Ceramic SMD
Crystal
Frequency Tolerance/Stability
±50ppm at 25°C, ±100ppm over -40°C to +85°C
Mode of Operation
AT-Cut Fundamental
RoHS
Pb
Packaging Options
Tape & Reel
ECCM9 C A 12 -26.000M TR
Nominal Frequency
26.000MHz
Load Capacitance
12pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Crystal Cut
Spurious Response
Storage Temperature Range
Insulation Resistance
26.000MHz
±50ppm at 25°C, ±100ppm over -40°C to +85°C
±3ppm/Year Maximum
12pF Parallel Resonant
7pF Maximum
50 Ohms Maximum
AT-Cut Fundamental
100µWatts Maximum, 10µWatts Correlation
AT-Cut
>3dB from Fo to Fo+5000ppm
-40°C to +125°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
3.2
±0.2
MARKING
ORIENTATION
3
5.0
±0.2
4
2
1
1.4 ±0.1
1.2 ±0.1 (X4)
2
3
4
2
2.6
±0.1
3
LINE MARKING
1
2
E26.00
E=Ecliptek
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
1
1.0
MAX
1
4
0.9 ±0.1
(X4)
Note: Chamfer not shown.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 8/12/2010 | Page 1 of 5
ECCM9CA12-26.000M TR
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.2 (X4)
1.5 (X4)
2.3
Solder Land
(X4)
1.0
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 8/12/2010 | Page 2 of 5
ECCM9CA12-26.000M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.2
2.0 ±0.2
DIA 1.5 ±0.1
0.30 ±0.05
7.5 ±0.2
16.0 ±0.3
6.75 ±0.20
5.7
±0.1
8.0 ±0.2
*Compliant to EIA 481A
3.8 ±0.1
1.4 ±0.1
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
18.4 MAX
180 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
12.4 +2.0/-0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 8/12/2010 | Page 3 of 5
ECCM9CA12-26.000M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 8/12/2010 | Page 4 of 5
ECCM9CA12-26.000M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 8/12/2010 | Page 5 of 5
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