OTP ROM, 64KX16, CMOS, CQCC32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | QCCN, LCC32,.45X.55 |
| Reach Compliance Code | compli |
| Maximum access time | 150 ns |
| I/O type | COMMON |
| JESD-30 code | R-XQCC-N32 |
| JESD-609 code | e0 |
| memory density | 1048576 bi |
| Memory IC Type | OTP ROM |
| memory width | 16 |
| Number of terminals | 32 |
| word count | 65536 words |
| character code | 64000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX16 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC32,.45X.55 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Certification status | Not Qualified |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.05 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| MBM27C1028-15CV | MBM27C1028-30Z | MBM27C1028-30CV | MBM27C1028-20CV | |
|---|---|---|---|---|
| Description | OTP ROM, 64KX16, CMOS, CQCC32 | OTP ROM, 64KX16, CMOS, CDIP28 | OTP ROM, 64KX16, CMOS, CQCC32 | OTP ROM, 64KX16, CMOS, CQCC32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCN, LCC32,.45X.55 | DIP, DIP28,.6 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 |
| Reach Compliance Code | compli | compli | compli | compli |
| Maximum access time | 150 ns | 300 ns | 300 ns | 200 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-XQCC-N32 | R-XDIP-T28 | R-XQCC-N32 | R-XQCC-N32 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 16 | 16 | 16 | 16 |
| Number of terminals | 32 | 28 | 32 | 32 |
| word count | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 | 64000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QCCN | DIP | QCCN | QCCN |
| Encapsulate equivalent code | LCC32,.45X.55 | DIP28,.6 | LCC32,.45X.55 | LCC32,.45X.55 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.05 mA | 0.03 mA | 0.03 mA | 0.05 mA |
| surface mount | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 |
京公网安备 11010802033920号
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