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MBM27C1028-30Z

Description
OTP ROM, 64KX16, CMOS, CDIP28
Categorystorage    storage   
File Size486KB,12 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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MBM27C1028-30Z Overview

OTP ROM, 64KX16, CMOS, CDIP28

MBM27C1028-30Z Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP28,.6
Reach Compliance Codecompli
Maximum access time300 ns
I/O typeCOMMON
JESD-30 codeR-XDIP-T28
JESD-609 codee0
memory density1048576 bi
Memory IC TypeOTP ROM
memory width16
Number of terminals28
word count65536 words
character code64000
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX16
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

MBM27C1028-30Z Related Products

MBM27C1028-30Z MBM27C1028-30CV MBM27C1028-15CV MBM27C1028-20CV
Description OTP ROM, 64KX16, CMOS, CDIP28 OTP ROM, 64KX16, CMOS, CQCC32 OTP ROM, 64KX16, CMOS, CQCC32 OTP ROM, 64KX16, CMOS, CQCC32
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DIP, DIP28,.6 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55
Reach Compliance Code compli compli compli compli
Maximum access time 300 ns 300 ns 150 ns 200 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-XDIP-T28 R-XQCC-N32 R-XQCC-N32 R-XQCC-N32
JESD-609 code e0 e0 e0 e0
memory density 1048576 bi 1048576 bi 1048576 bi 1048576 bi
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 16 16 16 16
Number of terminals 28 32 32 32
word count 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 64KX16 64KX16 64KX16 64KX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP QCCN QCCN QCCN
Encapsulate equivalent code DIP28,.6 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.03 mA 0.03 mA 0.05 mA 0.05 mA
surface mount NO YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE NO LEAD NO LEAD NO LEAD
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL QUAD QUAD QUAD
Base Number Matches 1 1 1 1
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