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TMS320F28379DZWTT

Description
Dual-Core Delfino Microcontroller 337-NFBGA -40 to 105
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size3MB,220 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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TMS320F28379DZWTT Overview

Dual-Core Delfino Microcontroller 337-NFBGA -40 to 105

TMS320F28379DZWTT Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionLFBGA, BGA337,19X19,32
Reach Compliance Codecompli
ECCN code3A991A2
Factory Lead Time6 weeks
Has ADCYES
Address bus width
bit size32
boundary scanYES
CPU seriesTMS320
maximum clock frequency100 MHz
DAC channelYES
DMA channelYES
External data bus width
FormatFLOATING-POINT
Integrated cacheNO
JESD-30 codeS-PBGA-B337
JESD-609 codee1
length16 mm
low power modeYES
Humidity sensitivity level3
Number of DMA channels12
Number of external interrupt devices5
Number of I/O lines169
Number of serial I/Os4
Number of terminals337
Number of timers6
On-chip data RAM width16
On-chip program ROM width16
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA337,19X19,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
RAM (bytes)208896
RAM (number of words)104448
rom(word)524288
ROM programmabilityFLASH
Maximum seat height1.4 mm
speed200 MHz
Maximum slew rate495 mA
Maximum supply voltage1.26 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width16 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
Base Number Matches1

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Description Dual-Core Delfino Microcontroller 337-NFBGA -40 to 105 32-bit Microcontrollers - MCU Soprano Dual-Core Delfino Microcontroller 176-HLQFP -40 to 105 Dual-Core Delfino Microcontroller 337-NFBGA -40 to 125 Dual-Core Delfino Microcontroller 176-HLQFP -40 to 125
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Contains lead Lead free Lead free Lead free
package instruction LFBGA, BGA337,19X19,32 , HLFQFP, QFP176,1.0SQ,20 LFBGA, BGA337,19X19,32 HLFQFP, QFP176,1.0SQ,20
Reach Compliance Code compli unknow compli compli compli
technology CMOS CMOS CMOS CMOS CMOS
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Is it Rohs certified? conform to - conform to conform to conform to
ECCN code 3A991A2 - 3A991A2 3A991A2 3A991A2
Factory Lead Time 6 weeks - 12 weeks 6 weeks 6 weeks
Has ADC YES - YES YES YES
bit size 32 - 32 32 32
boundary scan YES - YES YES YES
CPU series TMS320 - TMS320 TMS320 TMS320
maximum clock frequency 100 MHz - 100 MHz 100 MHz 100 MHz
DAC channel YES - YES YES YES
DMA channel YES - YES YES YES
Format FLOATING-POINT - FLOATING-POINT FLOATING-POINT FLOATING-POINT
Integrated cache NO - NO NO NO
JESD-30 code S-PBGA-B337 - S-PQFP-G176 S-PBGA-B337 S-PQFP-G176
JESD-609 code e1 - e4 e1 e4
length 16 mm - 24 mm 16 mm 24 mm
low power mode YES - YES YES YES
Humidity sensitivity level 3 - 3 3 3
Number of DMA channels 12 - 12 12 12
Number of external interrupt devices 5 - 5 5 5
Number of I/O lines 169 - 97 169 97
Number of serial I/Os 4 - 4 4 4
Number of terminals 337 - 176 337 176
Number of timers 6 - 6 6 6
On-chip data RAM width 16 - 16 16 16
On-chip program ROM width 16 - 16 16 16
Maximum operating temperature 105 °C - 105 °C 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C
PWM channel YES - YES YES YES
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA - HLFQFP LFBGA HLFQFP
Encapsulate equivalent code BGA337,19X19,32 - QFP176,1.0SQ,20 BGA337,19X19,32 QFP176,1.0SQ,20
Package shape SQUARE - SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH - FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
RAM (bytes) 208896 - 208896 208896 208896
RAM (number of words) 104448 - 104448 104448 104448
rom(word) 524288 - 524288 524288 524288
ROM programmability FLASH - FLASH FLASH FLASH
Maximum seat height 1.4 mm - 1.6 mm 1.4 mm 1.6 mm
speed 200 MHz - 200 MHz 200 MHz 200 MHz
Maximum slew rate 495 mA - 495 mA 495 mA 495 mA
Maximum supply voltage 1.26 V - 1.26 V 1.26 V 1.26 V
Minimum supply voltage 1.14 V - 1.14 V 1.14 V 1.14 V
Nominal supply voltage 1.2 V - 1.2 V 1.2 V 1.2 V
surface mount YES - YES YES YES
Temperature level INDUSTRIAL - INDUSTRIAL AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) - Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form BALL - GULL WING BALL GULL WING
Terminal pitch 0.8 mm - 0.5 mm 0.8 mm 0.5 mm
Terminal location BOTTOM - QUAD BOTTOM QUAD
width 16 mm - 24 mm 16 mm 24 mm
Base Number Matches 1 - 1 1 1
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