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DE28F800F3B115

Description
Flash, 512KX16, 19ns, PDSO56, 16 X 23.70 MM, SSOP-56
Categorystorage    storage   
File Size1MB,48 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

DE28F800F3B115 Overview

Flash, 512KX16, 19ns, PDSO56, 16 X 23.70 MM, SSOP-56

DE28F800F3B115 Parametric

Parameter NameAttribute value
Parts packaging codeSSOP
package instruction16 X 23.70 MM, SSOP-56
Contacts56
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time19 ns
Other featuresMIN 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK
startup blockBOTTOM
JESD-30 codeR-PDSO-G56
length23.7 mm
memory density8388608 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals56
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize512KX16
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Parallel/SerialPARALLEL
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height1.9 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
typeNOR TYPE
width13.3 mm
Base Number Matches1

DE28F800F3B115 Related Products

DE28F800F3B115 RC28F160F3B95 DE28F800F3T115
Description Flash, 512KX16, 19ns, PDSO56, 16 X 23.70 MM, SSOP-56 Flash, 512KX16, 95ns, PBGA64, BGA-64 Flash, 512KX16, 19ns, PDSO56, 16 X 23.70 MM, SSOP-56
Parts packaging code SSOP BGA SSOP
package instruction 16 X 23.70 MM, SSOP-56 TBGA, BGA64,8X8,40 16 X 23.70 MM, SSOP-56
Contacts 56 64 56
Reach Compliance Code unknow unknow unknow
ECCN code EAR99 EAR99 EAR99
Maximum access time 19 ns 95 ns 19 ns
Other features MIN 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK MIN 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK MIN 100,000 BLOCK ERASE CYCLES; TOP BOOT BLOCK
startup block BOTTOM BOTTOM TOP
JESD-30 code R-PDSO-G56 R-PBGA-B64 R-PDSO-G56
length 23.7 mm 13 mm 23.7 mm
memory density 8388608 bi 8388608 bi 8388608 bi
Memory IC Type FLASH FLASH FLASH
memory width 16 16 16
Number of functions 1 1 1
Number of terminals 56 64 56
word count 524288 words 524288 words 524288 words
character code 512000 512000 512000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 85 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C
organize 512KX16 512KX16 512KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP TBGA SSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH GRID ARRAY, THIN PROFILE SMALL OUTLINE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL
Programming voltage 3 V 2.7 V 3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.9 mm 1.2 mm 1.9 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 2.7 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level AUTOMOTIVE INDUSTRIAL AUTOMOTIVE
Terminal form GULL WING BALL GULL WING
Terminal pitch 0.8 mm 1 mm 0.8 mm
Terminal location DUAL BOTTOM DUAL
type NOR TYPE NOR TYPE NOR TYPE
width 13.3 mm 10 mm 13.3 mm
Base Number Matches 1 1 1

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